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Surface Insulation Resistance Degradation and Electrochemical Migration - Zhan, Sheng
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Zhan, Sheng:
Surface Insulation Resistance Degradation and Electrochemical Migration - Taschenbuch

2008, ISBN: 3836427273, Lieferbar binnen 4-6 Wochen

ID: 9783836427272

Internationaler Buchtitel. Verlag: VDM Verlag, Paperback, 132 Seiten, L=240mm, B=170mm, H=8mm, Gew.=263gr, [GR: 16560 - HC/Physikalische Chemie], Kartoniert/Broschiert, Klappentext: Widespread adoption of lead-free materials and processing for printed circuit board (PCB) assembly has raised reliability concerns regarding surface insulation resistance (SIR) degradation and electrochemical migration (ECM). As PCB conductor spacings decrease, electronic products become more susceptible to these failures mechanisms, especially in the presence of surface contamination and flux residues which might remain after no-clean processing. Moreover, the probability of failure due to SIR degradation and ECM is affected by the interaction between physical factors and chemical factors. Furthermore, the mechanism of electrochemical migration is not completely understood. In this book, the following research accomplishments are described: 1). Long-term temp-humidity-bias (THB) testing over 8,000 hours assessing the reliability of printed circuit boards processed with a variety of lead-free solder pastes, solder pad finishes, and substrates. 2). Identification of silver migration from Sn3.5Ag and Sn3.0Ag0.5Cu lead-free solder, a completely new finding compared with previous research. 3). Established the role of path formation as a step in the ECM process, and provided clarification of the sequence of individual steps in the mechanism of ECM. 4). Developed appropriate accelerated testing conditions for assessing the no-clean processed PCBs' susceptibility to ECM.

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Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - Sheng Zhan
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Sheng Zhan:
Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - Taschenbuch

ISBN: 3836427273

[SR: 6715636], Taschenbuch, [EAN: 9783836427272], VDM Verlag Dr. Müller, VDM Verlag Dr. Müller, Book, [PU: VDM Verlag Dr. Müller], VDM Verlag Dr. Müller, 557990, Physikalische Chemie, 290518, Chemie, 288100, Fachbücher, 541686, Kategorien, 186606, Bücher, 558024, Theoretische Chemie, 290518, Chemie, 288100, Fachbücher, 541686, Kategorien, 186606, Bücher, 189157, Chemie, 121, Naturwissenschaften & Technik, 541686, Kategorien, 186606, Bücher

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Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - Sheng Zhan
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
(*)
Sheng Zhan:
Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - Taschenbuch

ISBN: 3836427273

[SR: 6807651], Taschenbuch, [EAN: 9783836427272], VDM Verlag Dr. Müller, VDM Verlag Dr. Müller, Book, [PU: VDM Verlag Dr. Müller], VDM Verlag Dr. Müller, 557990, Physikalische Chemie, 290518, Chemie, 288100, Fachbücher, 541686, Kategorien, 186606, Bücher, 558024, Theoretische Chemie, 290518, Chemie, 288100, Fachbücher, 541686, Kategorien, 186606, Bücher, 189157, Chemie, 121, Naturwissenschaften & Technik, 541686, Kategorien, 186606, Bücher

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Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - Sheng Zhan
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
(*)
Sheng Zhan:
Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - Taschenbuch

ISBN: 3836427273

[SR: 6807651], Taschenbuch, [EAN: 9783836427272], VDM Verlag Dr. Müller, VDM Verlag Dr. Müller, Book, [PU: VDM Verlag Dr. Müller], VDM Verlag Dr. Müller, 557990, Physikalische Chemie, 290518, Chemie, 288100, Fachbücher, 541686, Kategorien, 186606, Bücher, 558024, Theoretische Chemie, 290518, Chemie, 288100, Fachbücher, 541686, Kategorien, 186606, Bücher, 189157, Chemie, 121, Naturwissenschaften & Technik, 541686, Kategorien, 186606, Bücher

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Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - Sheng Zhan
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
(*)
Sheng Zhan:
Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - Taschenbuch

ISBN: 3836427273

[SR: 6715636], Taschenbuch, [EAN: 9783836427272], VDM Verlag Dr. Müller, VDM Verlag Dr. Müller, Book, [PU: VDM Verlag Dr. Müller], VDM Verlag Dr. Müller, 557990, Physikalische Chemie, 290518, Chemie, 288100, Fachbücher, 541686, Kategorien, 186606, Bücher, 558024, Theoretische Chemie, 290518, Chemie, 288100, Fachbücher, 541686, Kategorien, 186606, Bücher, 189157, Chemie, 121, Naturwissenschaften & Technik, 541686, Kategorien, 186606, Bücher

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Details zum Buch
Surface Insulation Resistance Degradation and Electrochemical Migration

Widespread adoption of lead-free materials and processing for printed circuit board (PCB) assembly has raised reliability concerns regarding surface insulation resistance (SIR) degradation and electrochemical migration (ECM). As PCB conductor spacings decrease, electronic products become more susceptible to these failures mechanisms, especially in the presence of surface contamination and flux residues which might remain after no-clean processing. Moreover, the probability of failure due to SIR degradation and ECM is affected by the interaction between physical factors and chemical factors. Furthermore, the mechanism of electrochemical migration is not completely understood. In this book, the following research accomplishments are described: 1). Long-term temp-humidity-bias (THB) testing over 8,000 hours assessing the reliability of printed circuit boards processed with a variety of lead-free solder pastes, solder pad finishes, and substrates. 2). Identification of silver migration from Sn3.5Ag and Sn3.0Ag0.5Cu lead-free solder, a completely new finding compared with previous research. 3). Established the role of path formation as a step in the ECM process, and provided clarification of the sequence of individual steps in the mechanism of ECM. 4). Developed appropriate accelerated testing conditions for assessing the no-clean processed PCBs' susceptibility to ECM.

Detailangaben zum Buch - Surface Insulation Resistance Degradation and Electrochemical Migration


EAN (ISBN-13): 9783836427272
ISBN (ISBN-10): 3836427273
Taschenbuch
Erscheinungsjahr: 2008
Herausgeber: VDM Verlag
132 Seiten
Gewicht: 0,263 kg
Sprache: ger/Deutsch

Buch in der Datenbank seit 15.03.2008 06:41:49
Buch zuletzt gefunden am 30.12.2016 13:57:40
ISBN/EAN: 9783836427272

ISBN - alternative Schreibweisen:
3-8364-2727-3, 978-3-8364-2727-2


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