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Handbook of Wafer Bonding - Peter Ramm
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Peter Ramm:
Handbook of Wafer Bonding - neues Buch

2009, ISBN: 9783527326464

[ED: Buch], [PU: Wiley VCH Verlag GmbH], Neuware - Dr. Peter Ramm is head of the department Device and 3D Integration of Fraunhofer EMFT in Munich, Germany, where he is responsible for process integration of innovative devices and heterogeneous systems with a specific focus on 3D integration technologies. Dr. Ramm received the physics and Dr. rer. nat. degrees from the University of Regensburg and subsequently worked for Siemens in the DRAM facility where he was responsible for the process integration. In 1988 he joined Fraunhofer IFT in Munich, focusing for over two decades on 3D integration technologies. Peter Ramm is author or co-author of over 100 publications and 24 patents. He received the 'Ashman Award 2009' from the International Electronics Packaging Society (IMAPS) 'For Pioneering Work on 3D IC Stacking and Integration, and leading-edge work on SiGe and Si technologies'. Peter Ramm is Fellow and Life Member of IMAPS, organizing committee member of IEEE 3DIC conference and co-editor of Wileys 'Handbook of 3D Integration'., DE, [SC: 0.00], Neuware, gewerbliches Angebot, 530x170x10 mm, 395, [GW: 937g], offene Rechnung (Vorkasse vorbehalten), PayPal, Banküberweisung

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Handbook of Wafer Bonding - Peter Ramm
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
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Peter Ramm:
Handbook of Wafer Bonding - neues Buch

2009, ISBN: 9783527326464

[ED: Buch], [PU: Wiley VCH Verlag GmbH], Neuware - Dr. Peter Ramm is head of the department Device and 3D Integration of Fraunhofer EMFT in Munich, Germany, where he is responsible for process integration of innovative devices and heterogeneous systems with a specific focus on 3D integration technologies. Dr. Ramm received the physics and Dr. rer. nat. degrees from the University of Regensburg and subsequently worked for Siemens in the DRAM facility where he was responsible for the process integration. In 1988 he joined Fraunhofer IFT in Munich, focusing for over two decades on 3D integration technologies. Peter Ramm is author or co-author of over 100 publications and 24 patents. He received the 'Ashman Award 2009' from the International Electronics Packaging Society (IMAPS) 'For Pioneering Work on 3D IC Stacking and Integration, and leading-edge work on SiGe and Si technologies'. Peter Ramm is Fellow and Life Member of IMAPS, organizing committee member of IEEE 3DIC conference and co-editor of Wileys 'Handbook of 3D Integration'., DE, [SC: 0.00], Neuware, gewerbliches Angebot, FixedPrice, 395, [GW: 937g], offene Rechnung (Vorkasse vorbehalten), PayPal, Banküberweisung

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Handbook of Wafer Bonding - Peter Ramm
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(*)
Peter Ramm:
Handbook of Wafer Bonding - neues Buch

2009, ISBN: 9783527326464

[ED: Buch], [PU: Wiley VCH Verlag GmbH], Neuware - Dr. Peter Ramm is head of the department Device and 3D Integration of Fraunhofer EMFT in Munich, Germany, where he is responsible for process integration of innovative devices and heterogeneous systems with a specific focus on 3D integration technologies. Dr. Ramm received the physics and Dr. rer. nat. degrees from the University of Regensburg and subsequently worked for Siemens in the DRAM facility where he was responsible for the process integration. In 1988 he joined Fraunhofer IFT in Munich, focusing for over two decades on 3D integration technologies. Peter Ramm is author or co-author of over 100 publications and 24 patents. He received the 'Ashman Award 2009' from the International Electronics Packaging Society (IMAPS) 'For Pioneering Work on 3D IC Stacking and Integration, and leading-edge work on SiGe and Si technologies'. Peter Ramm is Fellow and Life Member of IMAPS, organizing committee member of IEEE 3DIC conference and co-editor of Wileys 'Handbook of 3D Integration'., DE, [SC: 0.00], Neuware, gewerbliches Angebot, 530x170x10 mm, 395, [GW: 937g], PayPal, Banküberweisung, Interntationaler Versand

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Handbook of Wafer Bonding - Peter Ramm
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Peter Ramm:
Handbook of Wafer Bonding - neues Buch

1, ISBN: 9783527326464

[ED: Buch], [PU: Wiley VCH Verlag GmbH], Neuware - Dr. Peter Ramm is head of the department Device and 3D Integration of Fraunhofer EMFT in Munich, Germany, where he is responsible for process integration of innovative devices and heterogeneous systems with a specific focus on 3D integration technologies. Dr. Ramm received the physics and Dr. rer. nat. degrees from the University of Regensburg and subsequently worked for Siemens in the DRAM facility where he was responsible for the process integration. In 1988 he joined Fraunhofer IFT in Munich, focusing for over two decades on 3D integration technologies. Peter Ramm is author or co-author of over 100 publications and 24 patents. He received the 'Ashman Award 2009' from the International Electronics Packaging Society (IMAPS) 'For Pioneering Work on 3D IC Stacking and Integration, and leading-edge work on SiGe and Si technologies'. Peter Ramm is Fellow and Life Member of IMAPS, organizing committee member of IEEE 3DIC conference and co-editor of Wileys 'Handbook of 3D Integration'., DE, [SC: 0.00], Neuware, gewerbliches Angebot, 246x175x25 mm, 395, [GW: 937g], Banküberweisung, PayPal

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Handbook of Wafer Bonding - Ramm, Peter; Lu, James Jian-Qiang; Taklo, Maaike M. V.
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Ramm, Peter; Lu, James Jian-Qiang; Taklo, Maaike M. V.:
Handbook of Wafer Bonding - neues Buch

ISBN: 9783527326464

ID: 822735

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories - Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries. Technology Technology eBook, Wiley

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Details zum Buch

Detailangaben zum Buch - Handbook of Wafer Bonding


EAN (ISBN-13): 9783527326464
ISBN (ISBN-10): 3527326464
Gebundene Ausgabe
Erscheinungsjahr: 2012
Herausgeber: Wiley VCH Verlag GmbH
395 Seiten
Gewicht: 0,937 kg
Sprache: Englisch

Buch in der Datenbank seit 14.09.2008 15:42:19
Buch zuletzt gefunden am 31.10.2017 21:06:53
ISBN/EAN: 9783527326464

ISBN - alternative Schreibweisen:
3-527-32646-4, 978-3-527-32646-4


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