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Three Dimensional System Integration - Antonis Papanikolaou
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ISBN: 9781441909626

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IC Stacking Process and Design Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. Three Dimensional System Integration: Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. CAD - Computer Aided Design Computer Aided Design ( CAD ) ARCHITECTURE / Methods & Materials, Springer-Verlag Gmbh

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Three Dimensional System Integration - Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic
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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g, mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g, mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. Methods & Materials, Architecture, Three Dimensional System Integration~~ Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic~~Methods & Materials~~Architecture~~9781441909626, en, Three Dimensional System Integration, Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic, 9781441909626, Springer, 12/07/2010, , , , Springer, 12/07/2010

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Three Dimensional System Integration - IC Stacking Process and Design - Papanikolaou, Antonis; Soudris, Dimitrios; Radojcic, Riko
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2010, ISBN: 1441909621

ID: 9781441909626

In englischer Sprache. Verlag: Springer US, The next step in system integration: the benefits of going 3-D.- Process technology for manufacturing Through-Silicon Vias (TSVs).- Alternative 3D integration schemes.- Manufacturing issues in 3D stacked ICs.- TSV characterization.- Physical design of 3D stacked ICs.- DRAM on logic stacking.- 3D general purpose micro-processors.- 3D system design: a holistic design approach. PC-PDF, 246 Seiten, VIII Seiten, 246 Seiten, [GR: 9685 - Nonbooks, PBS / Technik/Bautechnik, Umwelttechnik], [SW: - Technologie, Ingenieurswissenschaft, Landwirtschaft ], [Ausgabe: 2011][PU:Springer US], [PU: Springer]

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Three Dimensional System Integration - Antonis Papanikolaou; Dimitrios Soudris; Riko Radojcic
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Antonis Papanikolaou; Dimitrios Soudris; Riko Radojcic:
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ISBN: 9781441909626

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Architecture / Design; Basics of Construction; Circuits and Systems 3D Chip Stacking, 3D Integrated Circuit Design and Manufacturing, 3D Integrated Circuits, 3D Stacked Integrated Circuits, 3D System Integration, Contactless 3D Coupling, DRAM Stacking, Logic Stacking, TSV, Through-Silicon Vias Books eBook, Springer Science+Business Media

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2010, ISBN: 9781441909626

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IC Stacking Process and Design, [ED: 1], Auflage, eBook Download (PDF), eBooks, [PU: Springer-Verlag]

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Details zum Buch
Three Dimensional System Integration: IC Stacking Process and Design
Autor:

Antonis Papanikolaou;Dimitrios Soudris;Riko Radojcic

Titel:

Three Dimensional System Integration: IC Stacking Process and Design

ISBN-Nummer:

Detailangaben zum Buch - Three Dimensional System Integration: IC Stacking Process and Design


EAN (ISBN-13): 9781441909626
ISBN (ISBN-10): 1441909621
Erscheinungsjahr: 2010
Herausgeber: Springer US
246 Seiten
Sprache: eng/Englisch

Buch in der Datenbank seit 23.06.2012 02:28:56
Buch zuletzt gefunden am 22.03.2017 19:57:41
ISBN/EAN: 9781441909626

ISBN - alternative Schreibweisen:
1-4419-0962-1, 978-1-4419-0962-6


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