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Three Dimensional System Integration: IC Stacking Process and Design - Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic
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[SR: 5477602], Hardcover, [EAN: 9781441909619], Springer, Springer, Book, [PU: Springer], Springer, Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain., 266160, Drafting & Presentation, 173508, Architecture, 1, Arts & Photography, 1000, Subjects, 283155, Books, 3508, Computer Science, 3887, AI & Machine Learning, 760204, Bioinformatics, 132559011, Computer Simulation, 107196011, Cybernetics, 132574011, Human-Computer Interaction, 107197011, Information Theory, 3897, Robotics, 602672, Systems Analysis & Design, 5, Computers & Technology, 1000, Subjects, 283155, Books, 4075, CAD, 3939, Solidworks, 4134, Graphics & Design, 5, Computers & Technology, 1000, Subjects, 283155, Books, 107178011, Design, 13698, Circuits, 227544, Electrical & Electronics, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 1058, Methods & Materials, 1061, Architecture, 13803, Reference, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 468204, Computer Science, 491298, Algorithms, 491300, Artificial Intelligence, 491306, Database Storage & Design, 491308, Graphics & Visualization, 491302, Networking, 491310, Object-Oriented Software Design, 491312, Operating Systems, 491314, Programming Languages, 491316, Software Design & Engineering, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books, 468210, Architecture, 468206, Humanities, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books

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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. IC Stacking Process and Design Buch (fremdspr.) Bücher>Fremdsprachige Bücher>Englische Bücher, Springer

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Details zum Buch
Three Dimensional System Integration: IC Stacking Process and Design
Autor:

Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic

Titel:

Three Dimensional System Integration: IC Stacking Process and Design

ISBN-Nummer:

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

Detailangaben zum Buch - Three Dimensional System Integration: IC Stacking Process and Design


EAN (ISBN-13): 9781441909619
ISBN (ISBN-10): 1441909613
Gebundene Ausgabe
Taschenbuch
Erscheinungsjahr: 2010
Herausgeber: Springer-Verlag GmbH
246 Seiten
Gewicht: 0,527 kg
Sprache: eng/Englisch

Buch in der Datenbank seit 22.04.2008 15:15:08
Buch zuletzt gefunden am 01.02.2017 23:55:36
ISBN/EAN: 9781441909619

ISBN - alternative Schreibweisen:
1-4419-0961-3, 978-1-4419-0961-9


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