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Micro- and Opto-Electronic Materials and Structures. 2 vols. - Ephraim Suhir
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Ephraim Suhir:

Micro- and Opto-Electronic Materials and Structures. 2 vols. - gebunden oder broschiert

ISBN: 9780387279749

ID: 9780387279749

Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging The handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. Each chapter contains a summary of the state-of-the-art in a particular field and practical recommendations on how to apply current knowledge and technology to design, manufacture and operate a viable, reliable and cost-effective electronic component or photonic device, and on how to make such a device into a successful commercial product.The handbook can be used as a reference and as a manual for self-education. Designed and written for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists - this will be an essential reference for all those who are interested in the state-of-the-art of micro- and opto-electronic materials, packaging , and reliability, with an emphasis on physical design problems, challenges, and solutions. Micro- and Opto-Electronic Materials and Structures. 2 vols.: The handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. Each chapter contains a summary of the state-of-the-art in a particular field and practical recommendations on how to apply current knowledge and technology to design, manufacture and operate a viable, reliable and cost-effective electronic component or photonic device, and on how to make such a device into a successful commercial product.The handbook can be used as a reference and as a manual for self-education. Designed and written for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists - this will be an essential reference for all those who are interested in the state-of-the-art of micro- and opto-electronic materials, packaging , and reliability, with an emphasis on physical design problems, challenges, and solutions. Bau / Entwurf, Konstruktion Festkörperphysik Elektronik / Mikroelektronik Mikroelektronik Mikroskopie Optik Spektroskopie, Springer-Verlag Gmbh

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging - Ephraim Suhir, Y.C. Lee, C.P. Wong
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging - gebunden oder broschiert

ISBN: 0387279741

[SR: 212550], Gebundene Ausgabe, [EAN: 9780387279749], Springer, Springer, Book, [PU: Springer], Springer, 60525011, Elektronik, 60516011, Elektrotechnik, 60448011, Ingenieurwesen & Technik, 60447011, Architektur, Technik & Ingenieurswesen, 54071011, Genres, 52044011, Fremdsprachige Bücher, 60548011, Industriedesign, 60543011, Industrie, Herstellung & Abläufe, 60448011, Ingenieurwesen & Technik, 60447011, Architektur, Technik & Ingenieurswesen, 54071011, Genres, 52044011, Fremdsprachige Bücher, 60556011, Materialwissenschaft, 60448011, Ingenieurwesen & Technik, 60447011, Architektur, Technik & Ingenieurswesen, 54071011, Genres, 52044011, Fremdsprachige Bücher, 56398011, Festkörperphysik, 56375011, Physik, 56047011, Wissenschaft, 54071011, Genres, 52044011, Fremdsprachige Bücher, 1320310031, Statik, 56375011, Physik, 56047011, Wissenschaft, 54071011, Genres, 52044011, Fremdsprachige Bücher

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging - Ephraim Suhir, Y.C. Lee, C.P. Wong
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Ephraim Suhir, Y.C. Lee, C.P. Wong:
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging - gebunden oder broschiert

ISBN: 0387279741

[SR: 212550], Gebundene Ausgabe, [EAN: 9780387279749], Springer, Springer, Book, [PU: Springer], Springer, 60525011, Elektronik, 60516011, Elektrotechnik, 60448011, Ingenieurwesen & Technik, 60447011, Architektur, Technik & Ingenieurswesen, 54071011, Genres, 52044011, Fremdsprachige Bücher, 60548011, Industriedesign, 60543011, Industrie, Herstellung & Abläufe, 60448011, Ingenieurwesen & Technik, 60447011, Architektur, Technik & Ingenieurswesen, 54071011, Genres, 52044011, Fremdsprachige Bücher, 60556011, Materialwissenschaft, 60448011, Ingenieurwesen & Technik, 60447011, Architektur, Technik & Ingenieurswesen, 54071011, Genres, 52044011, Fremdsprachige Bücher, 56398011, Festkörperphysik, 56375011, Physik, 56047011, Wissenschaft, 54071011, Genres, 52044011, Fremdsprachige Bücher, 1320310031, Statik, 56375011, Physik, 56047011, Wissenschaft, 54071011, Genres, 52044011, Fremdsprachige Bücher

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ISBN: 9780387279749

[ED: Buch], [PU: Springer-Verlag GmbH], Neuware - This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product., [SC: 2.95], Neuware, gewerbliches Angebot, 270x155x76 mm, [GW: 3448g]

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Micro- and Opto-Electronic Materials and Structures. 2 vols. Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging - Suhir, Ephraim (Herausgeber)
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Micro- and Opto-Electronic Materials and Structures. 2 vols. Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging - gebunden oder broschiert

2007, ISBN: 0387279741

ID: A4372677

Gebundene Ausgabe Bau / Entwurf, Konstruktion, Festkörperphysik, Elektronik / Mikroelektronik, Mikroelektronik, Mikroskopie, Optik, Spektroskopie, met couverture neu, [PU:Springer-Verlag GmbH]

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Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechan
Autor:

Ephraim Suhir

Titel:

Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechan

ISBN-Nummer:

9780387279749

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Detailangaben zum Buch - Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechan


EAN (ISBN-13): 9780387279749
ISBN (ISBN-10): 0387279741
Gebundene Ausgabe
Erscheinungsjahr: 2007
Herausgeber: Springer-Verlag GmbH
1460 Seiten
Gewicht: 3,448 kg
Sprache: eng/Englisch

Buch in der Datenbank seit 22.01.2008 14:54:32
Buch zuletzt gefunden am 03.01.2017 15:43:05
ISBN/EAN: 9780387279749

ISBN - alternative Schreibweisen:
0-387-27974-1, 978-0-387-27974-9

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