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Pick-up Process Analysis of a Die Bonder - With Dynamic Computer Simulation and Taguchi Method - Lin, Yeong-Jyh / Hwang, Sheng-Jye
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Lin, Yeong-Jyh / Hwang, Sheng-Jye:
Pick-up Process Analysis of a Die Bonder - With Dynamic Computer Simulation and Taguchi Method - Taschenbuch

2008, ISBN: 9783639000344

[ED: Taschenbuch / Paperback], [PU: VDM Verlag Dr. Müller], The gallium arsenide (GaAs) circuits in advanced communication application have been considered to profoundly supersede the conventional silicon-based counterpart. Great improvements in the packaging of GaAs devices are needed to overcome the imminent handicap of its fragile characteristic Thin die represents the mainstream for IC packages to achieve the goal of manufacturing compact and light products with higher functionality. These trends tend to challenge the existing infrastructure, henceforth the creative design in connection with a unique die bonder in fabrication has been presented in this book. The general process to pick up a die was comprehensively investigated and then analyzed with computer simulations. Experiments were conducted to verify the simulation results. The die cracks due to the ejecting needle and the effects of parameter were analyzed by means of Taguchi Method. With this procedure, not only the parameters could be optimized but also the production yield was promoted. Besides, this method could be easily modified to simulate other type of die bonders with different mechanisms even a new procedure could be derived for the next generational die bonder., DE, [SC: 0.00], Neuware, gewerbliches Angebot, 220 mm, 136, [GW: 195g], Selbstabholung und Barzahlung, PayPal, offene Rechnung, Banküberweisung, Interntationaler Versand

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Pick-up Process Analysis of a Die Bonder - Yeong-Jyh Lin
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Yeong-Jyh Lin:
Pick-up Process Analysis of a Die Bonder - Taschenbuch

ISBN: 9783639000344

[ED: Taschenbuch], [PU: VDM Verlag Dr. Müller e.K.], Neuware - The gallium arsenide (GaAs) circuits in advanced communication application have been considered to profoundly supersede the conventional silicon-based counterpart. Great improvements in the packaging of GaAs devices are needed to overcome the imminent handicap of its fragile characteristic Thin die represents the mainstream for IC packages to achieve the goal of manufacturing compact and light products with higher functionality. These trends tend to challenge the existing infrastructure, henceforth the creative design in connection with a unique die bonder in fabrication has been presented in this book. The general process to pick up a die was comprehensively investigated and then analyzed with computer simulations. Experiments were conducted to verify the simulation results. The die cracks due to the ejecting needle and the effects of parameter were analyzed by means of Taguchi Method. With this procedure, not only the parameters could be optimized but also the production yield was promoted. Besides, this method could be easily modified to simulate other type of die bonders with different mechanisms even a new procedure could be derived for the next generational die bonder., DE, [SC: 0.00], Neuware, gewerbliches Angebot, 220x150x8 mm, 136, [GW: 219g], PayPal, offene Rechnung, Banküberweisung, Interntationaler Versand

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Pick-up Process Analysis of a Die Bonder - Yeong-Jyh Lin
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Yeong-Jyh Lin:
Pick-up Process Analysis of a Die Bonder - Taschenbuch

2013, ISBN: 363900034X

ID: 16085897938

[EAN: 9783639000344], Neubuch, [PU: VDM Verlag Dr. Müller E.K. Okt 2013], This item is printed on demand - Print on Demand Titel. Neuware - The gallium arsenide (GaAs) circuits in advanced communication application have been considered to profoundly supersede the conventional silicon-based counterpart. Great improvements in the packaging of GaAs devices are needed to overcome the imminent handicap of its fragile characteristic; Thin die represents the mainstream for IC packages to achieve the goal of manufacturing compact and light products with higher functionality. These trends tend to challenge the existing infrastructure, henceforth; the creative design in connection with a unique die bonder in fabrication has been presented in this book. The general process to pick up a die was comprehensively investigated and then analyzed with computer simulations. Experiments were conducted to verify the simulation results. The die cracks due to the ejecting needle; and the effects of parameter were analyzed by means of Taguchi Method. With this procedure, not only the parameters could be optimized but also the production yield was promoted. Besides, this method could be easily modified to simulate other type of die bonders with different mechanisms; even a new procedure could be derived for the next generational die bonder. 136 pp. Englisch

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Pick-up Process Analysis of a Die Bonder - Lin, Yeong-Jyh Hwang, Sheng-Jye
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Lin, Yeong-Jyh Hwang, Sheng-Jye:
Pick-up Process Analysis of a Die Bonder - Taschenbuch

2008, ISBN: 9783639000344

[ED: Softcover], [PU: Vdm Verlag Dr. Müller], The gallium arsenide (GaAs) circuits in advanced communication application have been considered to profoundly supersede the conventional silicon-based counterpart. Great improvements in the packaging of GaAs devices are needed to overcome the imminent handicap of its fragile characteristic Thin die represents the mainstream for IC packages to achieve the goal of manufacturing compact and light products with higher functionality. These trends tend to challenge the existing infrastructure, henceforth the creative design in connection with a unique die bonder in fabrication has been presented in this book. The general process to pick up a die was comprehensively investigated and then analyzed with computer simulations. Experiments were conducted to verify the simulation results. The die cracks due to the ejecting needle and the effects of parameter were analyzed by means of Taguchi Method. With this procedure, not only the parameters could be optimized but also the production yield was promoted. Besides, this method could be easily modified to simulate other type of die bonders with different mechanisms even a new procedure could be derived for the next generational die bonder.2008. 136 S. 220 mmVersandfertig in 3-5 Tagen, [SC: 0.00], Neuware, gewerbliches Angebot

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Pick-up Process Analysis of a Die Bonder - Yeong-Jyh Lin
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Pick-up Process Analysis of a Die Bonder - neues Buch

ISBN: 9783639000344

ID: d8cec80b9f4a428b78542ca453931d36

The gallium arsenide (GaAs) circuits in advanced communication application have been considered to profoundly supersede the conventional silicon-based counterpart. Great improvements in the packaging of GaAs devices are needed to overcome the imminent handicap of its fragile characteristic Thin die represents the mainstream for IC packages to achieve the goal of manufacturing compact and light products with higher functionality. These trends tend to challenge the existing infrastructure, henceforth the creative design in connection with a unique die bonder in fabrication has been presented in this book. The general process to pick up a die was comprehensively investigated and then analyzed with computer simulations. Experiments were conducted to verify the simulation results. The die cracks due to the ejecting needle and the effects of parameter were analyzed by means of Taguchi Method. With this procedure, not only the parameters could be optimized but also the production yield was promoted. Besides, this method could be easily modified to simulate other type of die bonders with different mechanisms even a new procedure could be derived for the next generational die bonder. Bücher / Naturwissenschaften, Medizin, Informatik & Technik / Technik, [PU: VDM Verlag Dr. Müller, Saarbrücken]

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Details zum Buch
Pick-up Process Analysis of a Die Bonder

The gallium arsenide (GaAs) circuits in advanced communication application have been considered to profoundly supersede the conventional silicon-based counterpart. Great improvements in the packaging of GaAs devices are needed to overcome the imminent handicap of its fragile characteristic; Thin die represents the mainstream for IC packages to achieve the goal of manufacturing compact and light products with higher functionality. These trends tend to challenge the existing infrastructure, henceforth; the creative design in connection with a unique die bonder in fabrication has been presented in this book. The general process to pick up a die was comprehensively investigated and then analyzed with computer simulations. Experiments were conducted to verify the simulation results. The die cracks due to the ejecting needle; and the effects of parameter were analyzed by means of Taguchi Method. With this procedure, not only the parameters could be optimized but also the production yield was promoted. Besides, this method could be easily modified to simulate other type of die bonders with different mechanisms; even a new procedure could be derived for the next generational die bonder.

Detailangaben zum Buch - Pick-up Process Analysis of a Die Bonder


EAN (ISBN-13): 9783639000344
ISBN (ISBN-10): 363900034X
Gebundene Ausgabe
Taschenbuch
Erscheinungsjahr: 2008
Herausgeber: VDM Verlag
136 Seiten
Gewicht: 0,219 kg
Sprache: eng/Englisch

Buch in der Datenbank seit 02.12.2008 15:52:03
Buch zuletzt gefunden am 30.09.2017 17:41:26
ISBN/EAN: 363900034X

ISBN - alternative Schreibweisen:
3-639-00034-X, 978-3-639-00034-4


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