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RF and Microwave Microelectronics Packaging - Ken Kuang
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Ken Kuang:
RF and Microwave Microelectronics Packaging - neues Buch

1, ISBN: 9781441909831

[ED: Buch], [PU: Springer-Verlag GmbH], Neuware - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices. -, DE, [SC: 0.00], Neuware, gewerbliches Angebot, 243x164x34 mm, 285, [GW: 635g], offene Rechnung (Vorkasse vorbehalten), PayPal, Banküberweisung, Internationaler Versand

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RF and Microwave Microelectronics Packaging - Ken Kuang
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
(*)
Ken Kuang:
RF and Microwave Microelectronics Packaging - neues Buch

1, ISBN: 9781441909831

[ED: Buch], [PU: Springer-Verlag GmbH], Neuware - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices., DE, [SC: 0.00], Neuware, gewerbliches Angebot, 243x164x34 mm, 285, [GW: 635g], PayPal, Banküberweisung, Internationaler Versand

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RF and Microwave Microelectronics Packaging - Ken Kuang
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
(*)
Ken Kuang:
RF and Microwave Microelectronics Packaging - neues Buch

2009, ISBN: 1441909834

ID: 9730369344

[EAN: 9781441909831], Neubuch, [SC: 0.0], [PU: Springer-Verlag Gmbh Nov 2009], ELEKTRONIK / MIKROELEKTRONIK; MIKROELEKTRONIK, Neuware - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices. 285 pp. Englisch

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(*) Derzeit vergriffen bedeutet, dass dieser Titel momentan auf keiner der angeschlossenen Plattform verfügbar ist.
RF and Microwave Microelectronics Packaging - Ken Kuang
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
(*)
Ken Kuang:
RF and Microwave Microelectronics Packaging - neues Buch

1, ISBN: 9781441909831

[ED: Buch], [PU: Springer-Verlag GmbH], Neuware - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields., DE, [SC: 0.00], Neuware, gewerbliches Angebot, 243x164x34 mm, 285, [GW: 635g], offene Rechnung (Vorkasse vorbehalten), PayPal, Banküberweisung

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RF and Microwave Microelectronics Packaging - Ken Kuang
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ISBN: 9781441909831

Hardback, [PU: Springer-Verlag New York Inc.], This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields., Microwave Technology

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Details zum Buch
RF and Microwave Microelectronics Packaging
Autor:

Ken Kuang

Titel:
ISBN-Nummer:

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Detailangaben zum Buch - RF and Microwave Microelectronics Packaging


EAN (ISBN-13): 9781441909831
ISBN (ISBN-10): 1441909834
Gebundene Ausgabe
Erscheinungsjahr: 2009
Herausgeber: Springer-Verlag GmbH
285 Seiten
Gewicht: 0,635 kg
Sprache: eng/Englisch

Buch in der Datenbank seit 09.08.2007 02:08:01
Buch zuletzt gefunden am 02.01.2018 07:58:05
ISBN/EAN: 1441909834

ISBN - alternative Schreibweisen:
1-4419-0983-4, 978-1-4419-0983-1


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