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Introduction to Microsystem Packaging Technology - Jin, Yufeng; Wang, Zhiping; Chen, Jing
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ISBN: 9781439819104

ID: 1026849

Introduction What are Microsystems Related Fundamentals of Microsystems What is Microsystems Packaging What is Microelectronics Packaging History of Microelectronics Packaging Status and Function of Microsystems Packaging Technology Technical Challenges in Microsystems Packaging Design Technique for Microsystems Packaging and Integration Electrical Design Thermal Management Design Mechanical Design Microfluidic Design Multi-disciplinary Design Substrate Technology Organic Substrate Ceramic Substrates Introduction of Typical Ceramic Substrates LTCC Substrates Advanced Substrates Interconnection Technology Braze-Welding Technology Wire Bonding Technology Tape Automated Bonding Technology Flip-Chip Bonding Technology Chip Interconnection in System-level Packaging Advanced interconnection Device Level Package Metal Package Plastic Package Ceramic Package Typical Examples of Device-level Package Development Prospect MEMS Packaging Function of MEMS Packaging Device Level Package for MEMS Wafer Level Package for MEMS Sealing Techniques Thin Film Encapsulation Vacuum Packaging for MEMS Case StudyA 3D Wafer Level Hermetical Packaging for MEMS Module Assembly and Optoelectronic Packaging Surface Mount Technology Packaging of Flat Panel Display Modules Optoelectronic Packaging System Level Packaging Technology Overview System on Chip Technology System in Package Technology RF System Package Technology Reliability Fundamentals of Reliability Methodology Wafer and Packaging-related Failure Mode and Mechanisms Reliability Qualification and Analysis Summary Prospects for Microsystems Packaging Technology Evolvement of Packaging Materials Evolvement and Application of Packaging Technologies Evolution of Packaging Technologies and Environmental Protection Conclusion Remarks References Technology Technology eBook, CRC Press

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Introduction to Microsystem Packaging Technology - Jin, Yufeng / Wang, Zhiping / Chen, Jing
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Vastly ahead of the field, this resource demonstrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. It also includes 3D-package and system level package development with a decidedly MEMS perspective. Involving the work of international engineers, this book presents a diversity of technologies in relation to MSP. It is the ultimate reference on this sophisticated level of package design and techniques. It covers encapsulation and sealing and system-in-package, as well as device level and optoelectronics packaging. It also includes modular assembly, inspection, and reliability design. The authors present a number of real-world case studies. Introduction to Microsystem Packaging Technology Jin, Yufeng / Wang, Zhiping / Chen, Jing, CRC Press

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Introduction to Microsystem Packaging Technology - Rebecca N. (Cornell Hospital Medical Center) Baergen
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Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology.This book also details 3D-package and system-level package development with a decidedly MEMS perspective.It presents various technologies in relation to MSP.; Paperback \ Rebecca N. (Cornell Hospital Medical Center) Baergen; Scientific, Technical and Medical > Industrial chemistry & manufacturing technologies > Other manufa, Springer-Verlag New York Inc.

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Introduction to Microsystem Packaging Technology - Jing Chen Yufeng Jin Zhiping Wang
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Introduction to Microsystem Packaging Technology Author :Jing Chen Yufeng Jin Zhiping Wang 9781439819104 1439819106, [PU: Productivity Press]

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Details zum Buch
Introduction to Microsystem Packaging Technology

Vastly ahead of the field, this resource illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. It also details 3D-package and system-level package development with a decidedly MEMS perspective. Integrating the work of international engineers, this book presents a diversity of technologies in relation to MSP. The ultimate reference on this sophisticated level of package design and techniques, it covers encapsulation and sealing and system-in-package, as well as device-level and optoelectronics packaging. It also includes coverage of modular assembly, inspection, and reliability design, with a number of real-world case studies.

Detailangaben zum Buch - Introduction to Microsystem Packaging Technology


EAN (ISBN-13): 9781439819104
ISBN (ISBN-10): 1439819106
Gebundene Ausgabe
Taschenbuch
Erscheinungsjahr: 2010
Herausgeber: CRC PR INC
232 Seiten
Sprache: eng/Englisch

Buch in der Datenbank seit 24.03.2010 09:18:20
Buch zuletzt gefunden am 10.11.2017 00:22:30
ISBN/EAN: 1439819106

ISBN - alternative Schreibweisen:
1-4398-1910-6, 978-1-4398-1910-4


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