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Nanoparticle Engineering for Chemical-mechanical Planarization - Ungyu Paik, Jea-Gun Park
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Ungyu Paik, Jea-Gun Park:
Nanoparticle Engineering for Chemical-mechanical Planarization - gebunden oder broschiert

ISBN: 1420059114

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[EAN: 9781420059113], Neubuch, [PU: Taylor & Francis Inc], Science|Chemistry|Industrial & Technical, Technology|Electronics|Microelectronics, Technology|Material Science, Technology|Nanotechnology, BRAND NEW, Nanoparticle Engineering for Chemical-mechanical Planarization, Ungyu Paik, Jea-Gun Park, In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.

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Nanoparticle Engineering for Chemical-mechanical Planarization (Hardback) - Ungyu Paik, Jea-Gun Park
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Ungyu Paik, Jea-Gun Park:
Nanoparticle Engineering for Chemical-mechanical Planarization (Hardback) - gebunden oder broschiert

2009, ISBN: 1420059114

ID: 2685273959

[EAN: 9781420059113], Neubuch, [PU: Taylor Francis Inc, United States], Science|Chemistry|Industrial & Technical, Technology|Electronics|Microelectronics, Technology|Material Science, Technology|Nanotechnology, Language: English . Brand New Book. In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.

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Nanoparticle Engineering for Chemical-mechanical Planarization (Hardback) - Ungyu Paik, Jea-Gun Park
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
(*)
Ungyu Paik, Jea-Gun Park:
Nanoparticle Engineering for Chemical-mechanical Planarization (Hardback) - gebunden oder broschiert

2009, ISBN: 1420059114

ID: 11228663021

[EAN: 9781420059113], Neubuch, [PU: Taylor Francis Inc, United States], Science|Chemistry|Industrial & Technical, Technology|Electronics|Microelectronics, Technology|Material Science, Technology|Nanotechnology, Language: English . Brand New Book. In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.

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Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices - Ungyu Paik
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ISBN: 9781420059113

ID: 87148902_nw

Livre, [PU: CRC Press]

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Nanoparticle Engineering for Chemical-mechanical Planarization - Ungyu Paik; Jea-Gun Park
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Ungyu Paik; Jea-Gun Park:
Nanoparticle Engineering for Chemical-mechanical Planarization - gebunden oder broschiert

2009, ISBN: 9781420059113

ID: 9226583

Hardcover, Buch, [PU: Crc Press Inc]

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Details zum Buch
Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices

Increasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. This comprehensive text also presents design techniques using polymeric additives to improve CMP performance.

Detailangaben zum Buch - Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices


EAN (ISBN-13): 9781420059113
ISBN (ISBN-10): 1420059114
Gebundene Ausgabe
Erscheinungsjahr: 2009
Herausgeber: CRC PR INC
191 Seiten
Gewicht: 0,499 kg
Sprache: eng/Englisch

Buch in der Datenbank seit 11.06.2008 00:04:11
Buch zuletzt gefunden am 18.09.2017 21:17:00
ISBN/EAN: 1420059114

ISBN - alternative Schreibweisen:
1-4200-5911-4, 978-1-4200-5911-3


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