- 5 Ergebnisse
Kleinster Preis: € 48,19, größter Preis: € 183,70, Mittelwert: € 90,33
1
Three Dimensional System Integration - Antonis Papanikolaou & Dimitrios Soudris & Riko Radojcic
Bestellen
bei Orellfuessli.ch
CHF 179,00
(ca. € 183,70)
Versand: € 18,471
Bestellengesponserter Link
Antonis Papanikolaou & Dimitrios Soudris & Riko Radojcic:

Three Dimensional System Integration - gebunden oder broschiert

ISBN: 9781441909619

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneo… Mehr…

Nr. A1007901002. Versandkosten:Lieferzeiten außerhalb der Schweiz 3 bis 21 Werktage, , Versandfertig innert 1 - 2 Werktagen, zzgl. Versandkosten. (EUR 18.47)
2
Bestellen
bei Biblio.co.uk
$ 68,38
(ca. € 63,81)
Versand: € 11,871
Bestellengesponserter Link

Antonis Papanikolaou:

Three Dimensional System Integration: IC Stacking Process and Design - gebunden oder broschiert

ISBN: 9781441909619

Hardback. New. Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. This results in consumer electronics (e.g., mobile, handheld… Mehr…

Versandkosten: EUR 11.87 The Saint Bookstore
3
Three Dimensional System Integration IC Stacking Process and Design - Papanikolaou, Antonis, Dimitrios Soudris  und Riko Radojcic
Bestellen
bei booklooker.de
€ 100,63
Versand: € 0,001
Bestellengesponserter Link
Papanikolaou, Antonis, Dimitrios Soudris und Riko Radojcic:
Three Dimensional System Integration IC Stacking Process and Design - gebrauchtes Buch

2010

ISBN: 9781441909619

[PU: Springer US], Neubindung, Buchschnitt leicht verkürzt, Buchrücken leicht angestoßen 5580211/12, DE, [SC: 0.00], gebraucht; sehr gut, gewerbliches Angebot, 2011, PayPal, Klarna-Sofort… Mehr…

Versandkosten:Free shipping. (EUR 0.00) Buchpark GmbH
4
Bestellen
bei alibris.com
$ 51,65
(ca. € 48,19)
Versand: € 0,001
Bestellengesponserter Link
Papanikolaou, Antonis (Editor), and Soudris, Dimitrios (Editor), and Radojcic, Riko (Editor):
Three Dimensional System Integration: IC Stacking Process and Design - gebunden oder broschiert

2010, ISBN: 9781441909619

Hard cover, New., Sewn binding. Cloth over boards. 246 p. Contains: Unspecified., New York, NY, [PU: Springer]

Versandkosten: EUR 0.00 Sparks, NV, Alibris
5
Three Dimensional System Integration: IC Stacking Process and Design
Bestellen
bei AbeBooks.com
$ 59,29
(ca. € 55,32)
Versand: € 3,991
Bestellengesponserter Link
Three Dimensional System Integration: IC Stacking Process and Design - gebunden oder broschiert

2010, ISBN: 1441909613

[EAN: 9781441909619], New book, [PU: Springer], Books

NEW BOOK. Versandkosten: EUR 3.99 Lucky's Textbooks, Dallas, TX, U.S.A. [60577173] [Rating: 5 (of 5)]

1Da einige Plattformen keine Versandkonditionen übermitteln und diese vom Lieferland, dem Einkaufspreis, dem Gewicht und der Größe des Artikels, einer möglichen Mitgliedschaft der Plattform, einer direkten Lieferung durch die Plattform oder über einen Drittanbieter (Marketplace), etc. abhängig sein können, ist es möglich, dass die von eurobuch angegebenen Versandkosten nicht mit denen der anbietenden Plattform übereinstimmen.

Bibliographische Daten des bestpassenden Buches

Details zum Buch
Three Dimensional System Integration: IC Stacking Process and Design

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

Detailangaben zum Buch - Three Dimensional System Integration: IC Stacking Process and Design


EAN (ISBN-13): 9781441909619
ISBN (ISBN-10): 1441909613
Gebundene Ausgabe
Taschenbuch
Erscheinungsjahr: 2010
Herausgeber: Springer
246 Seiten
Gewicht: 0,527 kg
Sprache: eng/Englisch

Buch in der Datenbank seit 2008-04-22T15:15:08+02:00 (Berlin)
Detailseite zuletzt geändert am 2023-06-08T23:36:15+02:00 (Berlin)
ISBN/EAN: 1441909613

ISBN - alternative Schreibweisen:
1-4419-0961-3, 978-1-4419-0961-9
Alternative Schreibweisen und verwandte Suchbegriffe:
Autor des Buches: papanikolaou, rado, papan, radojcic, riko
Titel des Buches: three dimensional design, integration, whole system design, process design


Daten vom Verlag:

Autor/in: Antonis Papanikolaou; Dimitrios Soudris; Riko Radojcic
Titel: Three Dimensional System Integration - IC Stacking Process and Design
Verlag: Springer; Springer US
246 Seiten
Erscheinungsjahr: 2010-12-15
New York; NY; US
Gedruckt / Hergestellt in Niederlande.
Gewicht: 1,190 kg
Sprache: Englisch
53,49 € (DE)
54,99 € (AT)
59,00 CHF (CH)
POD
VIII, 246 p.

BB; Basics of Construction; Hardcover, Softcover / Technik/Bautechnik, Umwelttechnik; Hochbau und Baustoffe; Verstehen; 3D Chip Stacking; 3D Integrated Circuit Design and Manufacturing; 3D Integrated Circuits; 3D Stacked Integrated Circuits; 3D System Integration; Contactless 3D Coupling; DRAM Stacking; Logic Stacking; TSV; Through-Silicon Vias; Circuits and Systems; Building Construction and Design; Electronic Circuits and Systems; Schaltkreise und Komponenten (Bauteile); BC; EA

Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides an overview of the entire trajectory from basic process technology issues to the design at the system level of three dimensionally integrated nano-electronic systems. Physical design and design at the architecture and system level are emphasized in this book, since the technology has matured to the point that these issues have become very important. This book is intended for an audience with a basic grasp of electrical engineering concepts including some familiarity with fabrication of semiconductor devices, Very Large Scale Integration (VLSI) and computer architecture. •Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; •Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems; •First book to offer not only a high-level view of the entire field of 3D integration, but also an understanding of the interactions between the various phases of design and manufacturing.

Weitere, andere Bücher, die diesem Buch sehr ähnlich sein könnten:

Neuestes ähnliches Buch:
9781489981820 Three Dimensional System Integration (Papanikolaou, Antonis|Soudris, Dimitrios|Radojcic, Riko)


< zum Archiv...