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Electromigration in ULSI Interconnections (International Series on Advances in Solid State Electronics and Technology) - Cher Ming Tan
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ISBN: 9814273325

[SR: 1551060], Hardcover, [EAN: 9789814273329], World Scientific Publishing Company, World Scientific Publishing Company, Book, [PU: World Scientific Publishing Company], World Scientific Publishing Company, Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electromigration are presented in a concise and rigorous manner. Methods of numerical modeling for the interconnect electromigration and their applications to the understanding of electromigration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electromigration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electromigration are outlined and discussed., 227544, Electrical & Electronics, 3747, Networks, 173515, Engineering, 173507, Professional & Technical, 1000, Subjects, 283155, Books, 21, Education & Reference, 11444, Almanacs & Yearbooks, 11448, Atlases & Maps, 2572, Careers, 11626, Catalogs & Directories, 69820, College & University, 11472, Consumer Guides, 11475, Dictionaries & Thesauruses, 11713, Encyclopedias, 11823, English as a Second Language, 11761, Etiquette, 11773, Foreign Language Study & Reference, 11880, Genealogy, 5267709011, Graduate School, 11902, Quotations, 5267708011, Schools & Teaching, 5267723011, Studying & Workbooks, 5267710011, Test Preparation, 11871, Trivia & Fun Facts, 11970, Words, Language & Grammar, 5267707011, Writing, Research & Publishing Guides, 1000, Subjects, 283155, Books, 468212, Engineering, 491336, Aeronautical Engineering, 491338, Chemical Engineering, 491340, Civil Engineering, 491342, Electrical & Electronic Engineering, 684258011, Environmental Engineering, 491346, Industrial Engineering, 491348, Mechanical Engineering, 684259011, Nuclear Engineering, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books

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Electromigration in Ulsi Interconnections - Tan, Cher Ming; Roy, Arijit
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ISBN: 9789814273329

ID: 731200

"Electromigration in ULSI Interconnections" provides a comprehensive description of the electro migration in integrated circuits. It is intended for both beginner and advanced readers on electro migration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electro migration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electro migration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electro migration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electro migration are presented in a concise and rigorous manner.Methods of numerical modeling for the interconnect electro migration and their applications to the understanding of electro migration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electro migration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electro migration are outlined and discussed. Technology Technology eBook, World Scientific Publishing Company

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Electromigration in Ulsi Interconnections - Cher Ming Tan
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Cher Ming Tan,Hardcover, English-language edition,Pub by World Scientific Publishing Company, Incorporated Textbooks New Books ~~ Technology~~ Electronics ~~ Circuits ~~ Integrated Electromigration-in-ULSI-Interconnections~~Cher-Ming-Tan World Scientific Publishing Company, Incorporated

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2010, ISBN: 9814273325, Lieferbar binnen 4-6 Wochen Versandkosten:Versandkostenfrei innerhalb der BRD

ID: 9789814273329

Internationaler Buchtitel. In englischer Sprache. Verlag: WORLD SCIENTIFIC PUB CO (, 291 Seiten, L=233mm, B=160mm, H=25mm, Gew.=570gr, [GR: 16850 - HC/Elektronik/Elektrotechnik/Nachrichtentechnik], [SW: - Technology & Industrial Arts], Gebunden

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Electromigration In Ulsi Interconnections Electromigration-in-ULSI-Interconnections~~Cher-Ming-Tan Science/Tech>Engineering>ELEC Engr Hardcover, World Scientific Publishing Company, Incorporated

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Electromigration in ULSI Interconnections (International Series on Advances in Solid State Electronics and Technology)
Autor:

Tan, Cher Ming

Titel:

Electromigration in ULSI Interconnections (International Series on Advances in Solid State Electronics and Technology)

ISBN-Nummer:

9814273325

Detailangaben zum Buch - Electromigration in ULSI Interconnections (International Series on Advances in Solid State Electronics and Technology)


EAN (ISBN-13): 9789814273329
ISBN (ISBN-10): 9814273325
Gebundene Ausgabe
Erscheinungsjahr: 2010
Herausgeber: WORLD SCIENTIFIC PUB CO (
291 Seiten
Gewicht: 0,570 kg
Sprache: eng/Englisch

Buch in der Datenbank seit 13.01.2012 18:40:48
Buch zuletzt gefunden am 02.09.2016 08:48:51
ISBN/EAN: 9814273325

ISBN - alternative Schreibweisen:
981-4273-32-5, 978-981-4273-32-9

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