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Kleinster Preis: 49.00 EUR, größter Preis: 50.40 EUR, Mittelwert: 49.35 EUR
High Performance Thermal-aware Distributed Computing - Pyla, Hari K.
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
(*)
Pyla, Hari K.:

High Performance Thermal-aware Distributed Computing - Taschenbuch

2008, ISBN: 3836435594, Lieferbar binnen 4-6 Wochen Versandkosten:Versandkostenfrei innerhalb der BRD

ID: 9783836435598

Internationaler Buchtitel. In englischer Sprache. Verlag: VDM Verlag, Paperback, 76 Seiten, L=240mm, B=170mm, H=5mm, Gew.=160gr, [GR: 16320 - HC/Informatik], Kartoniert/Broschiert, Klappentext: The power consumption of large scale clusters is now a critical design constraint in high-performance clusters. This increased power consumption and system densities have multiple side effects including increased operational costs, higher average operating temperatures which decreased reliability of microelectronics and, this additional heat which must be dissipated by complex cooling systems. For example, the Arrhenius equation states a temperature increase of 10 degrees Celsius results in reliability decrease of an electronic device by 50 percent. In this book, we discuss and analyze answers to common questions like: What parts of my parallel application will benefit from thermal management techniques?, Where do I start optimizing my parallel application to reduce thermals?, Are the thermal properties of my application similar across machines in a cluster?, What and where are the performance effects of thermal optimizations on my application?, How do I regulate thermals within the threshold limits and yet maintain performance? Readers with a background in the computer science, electrical and electronics engineering find this book interesting. The power consumption of large scale clusters is now a critical design constraint in high-performance clusters. This increased power consumption and system densities have multiple side effects including increased operational costs, higher average operating temperatures which decreased reliability of microelectronics and, this additional heat which must be dissipated by complex cooling systems. For example, the Arrhenius equation states a temperature increase of 10 degrees Celsius results in reliability decrease of an electronic device by 50 percent. In this book, we discuss and analyze answers to common questions like: What parts of my parallel application will benefit from thermal management techniques?, Where do I start optimizing my parallel application to reduce thermals?, Are the thermal properties of my application similar across machines in a cluster?, What and where are the performance effects of thermal optimizations on my application?, How do I regulate thermals within the threshold limits and yet maintain performance? Readers with a background in the computer science, electrical and electronics engineering find this book interesting.

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High Performance Thermal-aware Distributed Computing - Pyla, Hari K.
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
(*)

Pyla, Hari K.:

High Performance Thermal-aware Distributed Computing - Taschenbuch

2008, ISBN: 3836435594, Lieferbar binnen 4-6 Wochen

ID: 9783836435598

Internationaler Buchtitel. In englischer Sprache. Verlag: VDM Verlag, Paperback, 76 Seiten, L=240mm, B=170mm, H=5mm, Gew.=160gr, [GR: 16320 - HC/Informatik], Kartoniert/Broschiert, Klappentext: The power consumption of large scale clusters is now a critical design constraint in high-performance clusters. This increased power consumption and system densities have multiple side effects including increased operational costs, higher average operating temperatures which decreased reliability of microelectronics and, this additional heat which must be dissipated by complex cooling systems. For example, the Arrhenius equation states a temperature increase of 10 degrees Celsius results in reliability decrease of an electronic device by 50 percent. In this book, we discuss and analyze answers to common questions like: What parts of my parallel application will benefit from thermal management techniques?, Where do I start optimizing my parallel application to reduce thermals?, Are the thermal properties of my application similar across machines in a cluster?, What and where are the performance effects of thermal optimizations on my application?, How do I regulate thermals within the threshold limits and yet maintain performance? Readers with a background in the computer science, electrical and electronics engineering find this book interesting.

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(*) Derzeit vergriffen bedeutet, dass dieser Titel momentan auf keiner der angeschlossenen Plattform verfügbar ist.
High Performance Thermal-aware Distributed Computing - Pyla, Hari K.
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
(*)
Pyla, Hari K.:
High Performance Thermal-aware Distributed Computing - Taschenbuch

2008

ISBN: 3836435594

Lieferbar binnen 4-6 Wochen

ID: 9783836435598

Internationaler Buchtitel. In englischer Sprache. Verlag: VDM Verlag, Paperback, 76 Seiten, L=240mm, B=170mm, H=5mm, Gew.=160gr, [GR: 16320 - HC/Informatik], Kartoniert/Broschiert, Klappentext: The power consumption of large scale clusters is now a critical design constraint in high-performance clusters. This increased power consumption and system densities have multiple side effects including increased operational costs, higher average operating temperatures which decreased reliability of microelectronics and, this additional heat which must be dissipated by complex cooling systems. For example, the Arrhenius equation states a temperature increase of 10 degrees Celsius results in reliability decrease of an electronic device by 50 percent. In this book, we discuss and analyze answers to common questions like: What parts of my parallel application will benefit from thermal management techniques?, Where do I start optimizing my parallel application to reduce thermals?, Are the thermal properties of my application similar across machines in a cluster?, What and where are the performance effects of thermal optimizations on my application?, How do I regulate thermals within the threshold limits and yet maintain performance? Readers with a background in the computer science, electrical and electronics engineering find this book interesting.

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High Performance Thermal-aware Distributed Computing. - Hari K. Pyla
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Hari K. Pyla:
High Performance Thermal-aware Distributed Computing. - gebrauchtes Buch

2008, ISBN: 9783836435598

ID: a09129783836435598

Erscheinungsjahr: 2008., Verlag/Ort: VDM VERLAG DR. MÜLLER, 2008. 76 S. 22 cm Zustand: Neubuch. Artikel ist NEU! ISBN: 9783836435598. [The power consumption of large scale clusters is now a critical design constraint in high-performance clusters. This increased power consumption and system densities have multiple side effects including increased operational costs, higher average operating temperatures which decreased reliability of microelectronics and, this additional heat which must be dissipated by complex cooling systems. For example, the Arrhenius equation states a temperature increase of 10 degrees Celsius results in reliability decrease of an electronic device by 50 percent. In this book, we discuss and analyze answers to common questions like: What parts of my parallel application will benefit from thermal management techniques, Where do I start optimizing my parallel application to reduce thermals, Are the thermal properties of my application similar across machines in a cluster, What and where are the performance effects of thermal optimizations on my application, How do I regulate thermals within the threshold limits and yet maintain performance Readers with a background in the computer science, electrical and electronics engineering find this book interesting.[ -- Kategorie: Informatik]

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Details zum Buch
High Performance Thermal-aware Distributed Computing
Autor:

Pyla, Hari K.

Titel:

High Performance Thermal-aware Distributed Computing

ISBN-Nummer:

9783836435598

The power consumption of large scale clusters is now a critical design constraint in high-performance clusters. This increased power consumption and system densities have multiple side effects including increased operational costs, higher average operating temperatures which decreased reliability of microelectronics and, this additional heat which must be dissipated by complex cooling systems. For example, the Arrhenius equation states a temperature increase of 10 degrees Celsius results in reliability decrease of an electronic device by 50 percent. In this book, we discuss and analyze answers to common questions like: What parts of my parallel application will benefit from thermal management techniques?, Where do I start optimizing my parallel application to reduce thermals?, Are the thermal properties of my application similar across machines in a cluster?, What and where are the performance effects of thermal optimizations on my application?, How do I regulate thermals within the threshold limits and yet maintain performance? Readers with a background in the computer science, electrical and electronics engineering find this book interesting.

Detailangaben zum Buch - High Performance Thermal-aware Distributed Computing


EAN (ISBN-13): 9783836435598
ISBN (ISBN-10): 3836435594
Taschenbuch
Erscheinungsjahr: 2008
Herausgeber: VDM Verlag
76 Seiten
Gewicht: 0,160 kg
Sprache: eng/Englisch

Buch in der Datenbank seit 03.06.2008 08:41:45
Buch zuletzt gefunden am 02.03.2011 09:12:38
ISBN/EAN: 9783836435598

ISBN - alternative Schreibweisen:
3-8364-3559-4, 978-3-8364-3559-8

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