2012, ISBN: 1461359422
[EAN: 9781461359425], Neubuch, [SC: 0.0], [PU: Springer US], COUNTER; HARDWARE; SIGNAL; WAFER; ANALOG; CIRCUIT; COMPLEXITY; INTEGRATEDCIRCUIT; INTERCONNECT; MODEL; MODELING; SEMICONDUCTOR… Mehr…
ZVAB.com AHA-BUCH GmbH, Einbeck, Germany [51283250] [Rating: 5 (von 5)] NEW BOOK. Versandkosten:Versandkostenfrei. (EUR 0.00) Details... |
2012, ISBN: 1461359422
[EAN: 9781461359425], Neubuch, [SC: 0.0], [PU: Springer US], COUNTER; HARDWARE; SIGNAL; WAFER; ANALOG; CIRCUIT; COMPLEXITY; INTEGRATEDCIRCUIT; INTERCONNECT; MODEL; MODELING; SEMICONDUCTOR… Mehr…
ZVAB.com AHA-BUCH GmbH, Einbeck, Germany [51283250] [Rating: 5 (von 5)] NEW BOOK. Versandkosten:Versandkostenfrei. (EUR 0.00) Details... |
ISBN: 9781461359425
Paperback, [PU: Springer-Verlag New York Inc.], The goal ofputting "systems on a chip" has been a difficultchallenge that is only recently beginning to be met. Since the world is "analog"… Mehr…
BookDepository.com Versandkosten:Versandkostenfrei. (EUR 0.00) Details... |
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (The Springer International Series in Engineering and Computer Science, 302, Band 302) - Taschenbuch
1994, ISBN: 9781461359425
Springer, Taschenbuch, Auflage: Softcover reprint of the original 1st ed. 1995, 308 Seiten, Publiziert: 1994-12-31T00:00:01Z, Produktgruppe: Buch, Hersteller-Nr.: black & white illustrati… Mehr…
amazon.de preigu Versandkosten:Gewöhnlich versandfertig in 6 bis 7 Tagen. Die angegebenen Versandkosten können von den tatsächlichen Kosten abweichen. (EUR 3.00) Details... |
ISBN: 9781461359425
Springer . Papeback. New. pp. 308 Index, Springer, 6
Biblio.co.uk |
2012, ISBN: 1461359422
[EAN: 9781461359425], Neubuch, [SC: 0.0], [PU: Springer US], COUNTER; HARDWARE; SIGNAL; WAFER; ANALOG; CIRCUIT; COMPLEXITY; INTEGRATEDCIRCUIT; INTERCONNECT; MODEL; MODELING; SEMICONDUCTOR… Mehr…
Nishath K. Verghese:
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - Taschenbuch2012, ISBN: 1461359422
[EAN: 9781461359425], Neubuch, [SC: 0.0], [PU: Springer US], COUNTER; HARDWARE; SIGNAL; WAFER; ANALOG; CIRCUIT; COMPLEXITY; INTEGRATEDCIRCUIT; INTERCONNECT; MODEL; MODELING; SEMICONDUCTOR… Mehr…
ISBN: 9781461359425
Paperback, [PU: Springer-Verlag New York Inc.], The goal ofputting "systems on a chip" has been a difficultchallenge that is only recently beginning to be met. Since the world is "analog"… Mehr…
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (The Springer International Series in Engineering and Computer Science, 302, Band 302) - Taschenbuch
1994, ISBN: 9781461359425
Springer, Taschenbuch, Auflage: Softcover reprint of the original 1st ed. 1995, 308 Seiten, Publiziert: 1994-12-31T00:00:01Z, Produktgruppe: Buch, Hersteller-Nr.: black & white illustrati… Mehr…
ISBN: 9781461359425
Springer . Papeback. New. pp. 308 Index, Springer, 6
Bibliographische Daten des bestpassenden Buches
Detailangaben zum Buch - Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (The Springer International Series in Engineering and Computer Science, 302, Band 302)
EAN (ISBN-13): 9781461359425
ISBN (ISBN-10): 1461359422
Taschenbuch
Erscheinungsjahr: 1995
Herausgeber: Springer
Buch in der Datenbank seit 2014-10-09T22:47:04+02:00 (Berlin)
Detailseite zuletzt geändert am 2023-04-11T12:22:08+02:00 (Berlin)
ISBN/EAN: 9781461359425
ISBN - alternative Schreibweisen:
1-4613-5942-2, 978-1-4613-5942-5
Alternative Schreibweisen und verwandte Suchbegriffe:
Autor des Buches: verg
Titel des Buches: signal, coupling, integrated circuits
Daten vom Verlag:
Autor/in: Nishath K. Verghese; Timothy J. Schmerbeck; David J. Allstot
Titel: The Springer International Series in Engineering and Computer Science; Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Verlag: Springer; Springer US
280 Seiten
Erscheinungsjahr: 2012-10-10
New York; NY; US
Gedruckt / Hergestellt in Niederlande.
Gewicht: 0,474 kg
Sprache: Englisch
160,49 € (DE)
164,99 € (AT)
177,00 CHF (CH)
POD
XXIII, 280 p.
BC; Circuits and Systems; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Schaltkreise und Komponenten (Bauteile); Verstehen; Counter; Hardware; Signal; Wafer; analog; circuit; complexity; integrated circuit; interconnect; model; modeling; semiconductor; simulation; tables; Electrical Engineering; Electronic Circuits and Systems; Electrical and Electronic Engineering; Elektrotechnik; BB
List of Figures. List of Tables. Preface. 1. Introduction. 2. Sources of Noise and Methods of Coupling. 3. Semiconductor Device Simulation. 4. Simplified Substrate Modeling and Rapid Simulation. 5. Mesh Generation. 6. Substrate Modeling in Heavily-Doped Bulk Process. 7. Substrate Resistance Extraction for Large Circuits. 8. Modeling Chip/Package Power Distribution. 9. Controlling Substrate Coupling in Heavily-Doped Bulk Processes. 10. Controlling Substrate Coupling in Bulk P-Wafers. 11. Chip/Package Shielding and Good Circuit Design Practice. 12. A Design Example. Appendices. A: Mesh Moments. B: Convergence Behaviour of Iterative Methods. Index.Weitere, andere Bücher, die diesem Buch sehr ähnlich sein könnten:
Neuestes ähnliches Buch:
9781461522393 Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (David J. Allstot; Timothy J. Schmerbeck; Nishath K. Verghese)
- 9781461522393 Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (David J. Allstot; Timothy J. Schmerbeck; Nishath K. Verghese)
- 9780792395447 Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (Nishath K. Verghese)
- Simulation Techniques and Solutions for Mixed-Signal Coupling integrated Circuits (Verghese, Nishath K./ Schmerbeck, Timothy J./ Allstot, David J.)
< zum Archiv...