- 5 Ergebnisse
Kleinster Preis: € 44,95, größter Preis: € 198,12, Mittelwert: € 129,37
1
Structural Analysis of Printed Circuit Board Systems by Peter A. Engel Hardcover | Indigo Chapters
Bestellen
bei Indigo.ca
C$ 285,95
(ca. € 198,12)
Bestellengesponserter Link

Structural Analysis of Printed Circuit Board Systems by Peter A. Engel Hardcover | Indigo Chapters - neues Buch

ISBN: 9780387979397

This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of vie… Mehr…

new in stock. Versandkosten:zzgl. Versandkosten.
2
Structural Analysis of Printed Circuit Board Systems. - Engel, Peter A.
Bestellen
bei ZVAB.com
€ 44,95
Versand: € 2,901
Bestellengesponserter Link

Engel, Peter A.:

Structural Analysis of Printed Circuit Board Systems. - gebunden oder broschiert

1993, ISBN: 0387979395

[EAN: 9780387979397], Gebraucht, sehr guter Zustand, [SC: 2.9], [PU: Springer], 291 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trä… Mehr…

NOT NEW BOOK. Versandkosten: EUR 2.90 books4less (Versandantiquariat Petra Gros GmbH & Co. KG), Koblenz, Germany [1048006] [Rating: 5 (von 5)]
3
Structural Analysis of Printed Circuit Board Systems. - Engel, Peter A.
Bestellen
bei Achtung-Buecher.de
€ 47,90
Versand: € 0,001
Bestellengesponserter Link
Engel, Peter A.:
Structural Analysis of Printed Circuit Board Systems. - gebunden oder broschiert

1993

ISBN: 0387979395

gebundene Ausgabe 291 Seiten; Gebundene Ausgabe Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rück… Mehr…

Versandkosten:Versandkostenfrei innerhalb der BRD. (EUR 0.00) Versandantiquariat Petra Gros GmbH & Co. KG, 56070 Koblenz
4
Structural Analysis of Printed Circuit Board Systems - Engel, Peter A.
Bestellen
bei Achtung-Buecher.de
€ 166,82
Versand: € 0,001
Bestellengesponserter Link
Engel, Peter A.:
Structural Analysis of Printed Circuit Board Systems - gebunden oder broschiert

1993, ISBN: 0387979395

1993 Gebundene Ausgabe Klassische Mechanik, Elektronik, Sensor; deformation; elasticity; Fatigue; Interferometry; Material; modeling; structuralanalysis; testing; Transistor, mit Schutz… Mehr…

Versandkosten:Versandkostenfrei innerhalb der BRD. (EUR 0.00) MARZIES.de Buch- und Medienhandel, 14621 Schönwalde-Glien
5
Structural Analysis of Printed Circuit Board Systems - Engel, Peter A.
Bestellen
bei Achtung-Buecher.de
€ 189,07
Versand: € 0,001
Bestellengesponserter Link
Engel, Peter A.:
Structural Analysis of Printed Circuit Board Systems - gebunden oder broschiert

1993, ISBN: 0387979395

1993 Gebundene Ausgabe Klassische Mechanik, Elektronik, Sensor; deformation; elasticity; Fatigue; Interferometry; Material; modeling; structuralanalysis; testing; Transistor, mit Schutz… Mehr…

Versandkosten:Versandkostenfrei innerhalb der BRD. (EUR 0.00) MARZIES.de Buch- und Medienhandel, 14621 Schönwalde-Glien

1Da einige Plattformen keine Versandkonditionen übermitteln und diese vom Lieferland, dem Einkaufspreis, dem Gewicht und der Größe des Artikels, einer möglichen Mitgliedschaft der Plattform, einer direkten Lieferung durch die Plattform oder über einen Drittanbieter (Marketplace), etc. abhängig sein können, ist es möglich, dass die von eurobuch angegebenen Versandkosten nicht mit denen der anbietenden Plattform übereinstimmen.

Bibliographische Daten des bestpassenden Buches

Details zum Buch
Structural Analysis of Printed Circuit Board Systems by Peter A. Engel Hardcover | Indigo Chapters

This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.

Detailangaben zum Buch - Structural Analysis of Printed Circuit Board Systems by Peter A. Engel Hardcover | Indigo Chapters


EAN (ISBN-13): 9780387979397
ISBN (ISBN-10): 0387979395
Gebundene Ausgabe
Taschenbuch
Erscheinungsjahr: 1993
Herausgeber: Peter A. Engel
316 Seiten
Gewicht: 0,637 kg
Sprache: eng/Englisch

Buch in der Datenbank seit 2007-01-27T10:14:37+01:00 (Berlin)
Detailseite zuletzt geändert am 2023-09-13T16:40:40+02:00 (Berlin)
ISBN/EAN: 9780387979397

ISBN - alternative Schreibweisen:
0-387-97939-5, 978-0-387-97939-7
Alternative Schreibweisen und verwandte Suchbegriffe:
Autor des Buches: peter engel, engels peter
Titel des Buches: circuit analysis, structural systems, around the circuit, system board


Daten vom Verlag:

Autor/in: Peter A. Engel
Titel: Mechanical Engineering Series; Structural Analysis of Printed Circuit Board Systems
Verlag: Springer; Springer US
291 Seiten
Erscheinungsjahr: 1993-06-24
New York; NY; US
Gewicht: 1,370 kg
Sprache: Englisch
160,49 € (DE)
164,99 € (AT)
177,00 CHF (CH)
POD
XIX, 291 p.

BB; Classical Mechanics; Hardcover, Softcover / Physik, Astronomie/Mechanik, Akustik; Klassische Mechanik; Verstehen; Sensor; deformation; elasticity; fatigue; interferometry; material; modeling; structural analysis; testing; transistor; Characterization and Evaluation of Materials; Electronics and Microelectronics, Instrumentation; Classical Mechanics; Characterization and Analytical Technique; Electronics and Microelectronics, Instrumentation; Werkstoffprüfung; Elektronik; BC; EA

1. Elements of Structural Analysis.- 1. Rods.- 2. Beams.- 2.1. Flexure.- 2.2. Beams on Elastic Foundation.- 2.3. Torsion.- 2.4. Frames.- 3. Plates.- 3.1. Cylindrical Bending.- 3.2. Pure Bending.- 3.3. Circular Plates.- 3.4. Rectangular Plates in Flexure.- 4. Thermal Stress.- 4.1. One-Dimensional Treatment: Bimaterial Rods.- 4.2. Timoshenko’s Formula for Thermal Bending of Bimaterial Circular Plates.- 5. Plastic Beam Deformation.- 6. Energy Methods in Structural Analysis.- 7. Experimental Methods of Analysis.- 7.1. Load Testers.- 7.2. Strain Gauges.- 7.3. Capacitance Measurement.- 7.4. Fiberoptic Probe/Photodiode Measurement.- 7.5. Photoelasticity.- 7.6. Holographic Interferometry.- 7.7. Piezo-electric Stress Sensors.- 7.8. Moire Interferometry.- 7.9. Electrical Resistance Method.- References.- 2. Finite Element Analysis.- 1. Preliminaries.- 2. Direct Stiffness Matrix Approach.- 3. The Principle of Minimum Potential Energy.- 4. Element Types.- 5. Finite Element Dynamic Analysis.- 6. Stress and Strain Calculations.- 7. Structural Codes.- 8. Steps in the Use of Finite Element Analysis.- References.- 3. Components, Data, and Testing.- 1. Modules.- 2. Circuit Cards and Boards.- 2.1. General Description.- 2.2. Properties of Laminated Construction.- 3. Pin Leads of PGA Modules.- 4. Strength of Compliant Leads in Surface-Mount Construction.- 5. Stiffness of Compliant Leads.- 6. Solder Strength.- References.- 4. Leadless Chip Carriers.- 1. Loads and Materials.- 2. Thermal Stress Analysis.- 3. The Influence of Solder Joint Shape.- 4. Constitutive Equation for Solder Mount.- 5. Conclusions.- 6. Exercises and Questions.- References.- 5. Thermal Stress in Pin-Grid Arrays: Primary Analysis of Pins.- 1. Introduction.- 2. Elastic Foundation Modulus of a Soldered Pin.- 3. Elastic Foundation Treatment for the Embedded Pin.- 4. Solder Pressure Calculation.- 5. Plastic Analysis of the Pin.- 6. Axial Pin Force Due to Flexure.- 7. A Magnified-Scale Experiment.- 8. Conclusions.- 9. Exercises and Questions.- References.- 6. Thermal Stress in Pin-Grid Arrays: Interaction Between Module and Circuit Card.- 1. Pin Force Analysis Due to Module and Card Bending.- 2. Influence of Pin-End Moments.- 3. Influence of the Primary Axial Pin Forces.- 4. Influence of Secondary Axial Pin Forces.- 5. Solution of the System of Equations.- 6. Module and Card Stretch Due to Pin Shear.- 7. System Reduction Factor.- 8. Conclusions.- 9. Exercises and Questions.- References.- 7. Compliant Leaded Systems: The Local Assembly.- 1. Experimental Studies.- 2. Analytical Model.- 3. Properties of Simple Local Assemblies.- 4. Discrete Local Assembly.- 5. Built-up (Multiple-Module) Local Assemblies.- 5.1. Stacked-Module Arrangement.- 5.2. Double-Sided Module Assemblies.- 5.3. Card Longer Than Module.- 5.4. Experimental Results.- 6. Orthotropy of Local Assemblies.- 7. Module Group Assemblies.- 8. Conclusions.- 9. Exercises and Questions.- References.- 8. Bending in Compliant Leaded Systems.- 1. The Role of Leads.- 2. Application of the Finite Element Method.- 3. Strip Method.- 4. Building Block Method.- 5. Hybrid Experimental/Analytical Method.- 6. Conclusions.- 7. Exercises and Questions.- References.- 9. Approximate Engineering Theory for the Twisting of Compliant Leaded Circuit Card/Module Systems.- 1. Fundamental Approach.- 2. Torsional Stiffness Calculation.- 3. Rectangular Cards with a Module.- 4. Module Clusters.- 5. Finite Element Check of the Approximate Theory.- 6. Conclusions.- 7. Exercises and Questions.- References.- 10. Analytical Theory and Experimental Work in Compliant Leaded Systems Subjected to Twisting.- 1. Analytical Theory.- 2. Torsional Stiffness.- 3. Experimental Study.- 4. Large Displacements.- 5. Approximate Large Displacement Analysis of a Square Card.- 6. Torsional Fatigue.- 7. Conclusions.- 8. Exercises and Questions.- References.- 11. Thermal Stresses in Compliant Leaded Systems.- 1. Motivation for Analysis.- 2. Analytical Lead Stress Computation.- 2.1. Plane Frame Analysis.- 2.2. Three-Dimensional Frame Analysis.- 3. Finite Element Thermal Stress Analysis.- 4. Stress Reduction in Compliant Leaded Solder Joints.- 5. Thermal Fatigue in Solder Joints of Compliant Leads.- 6. Thermal Cycling Reliability.- 7. Exercises and Questions.- References.- 12. Dynamic Response of Circuit Card Systems.- 1. General Considerations.- 2. Dynamic Load Levels and Measurement.- 3. Vibration Analysis in Circuit Card Systems.- 4. Transient Vibration and Shock Response.- 5. Fatigue Considerations.- 6. Conclusions.- 7. Exercises and Questions.- References.- 13. Plated Holes in Cards and Boards.- 1. Introduction.- 2. Thermal Stress from Module-to-Card Mismatch.- 3. Thermal Stress from Barrel-to-Board Mismatch.- 3.1. Failure Mechanisms.- 3.2. Structural Modeling.- 3.3. Finite Element Models.- 3.4. Copper Inner-Plane Bending.- 4. Experimental Methods.- 5. Vias.- 6. Conclusions.- 7. Exercises and Questions.- References.- 14. Assembly of Cards and Boards.- 1. Physical Description.- 2. ZIF Connector Actuation.- 3. Connector Contact.- 3.1. Contact Forces and Friction Regimes.- 3.2. Electrical Contact Resistance.- 3.3. Plating Ductility.- 3.4. Friction and Wear (Tribology).- 3.5. Contact Temperature.- 4. Dynamic Response.- 5. Thermal Stress.- 6. A Combined Permanent and Separable Connector System.- 7. Conclusions.- 8. Exercises and Questions.- References.- Author Index.

< zum Archiv...