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Handbook of Wafer Bonding - Wiley-Vch Verlag GmbH
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Handbook of Wafer Bonding - neues Buch

ISBN: 9783527326464

ID: 236972571

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories - Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries. Filling a gap for a handbook and reference on recent developments in wafer bonding technology, an author and editor team from microsystems companies and industry-near research organizations presents reliable, first-hand information. Buch (fremdspr.) Bücher>Fremdsprachige Bücher>Englische Bücher, Wiley-Vch Verlag GmbH

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Handbook of Wafer Bonding - Wiley-Vch Verlag GmbH
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Wiley-Vch Verlag GmbH:

Handbook of Wafer Bonding - neues Buch

ISBN: 9783527326464

ID: 140432161

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries. Filling a gap for a handbook and reference on recent developments in wafer bonding technology, an author and editor team from microsystems companies and industry-near research organizations presents reliable, first-hand information. Buch (fremdspr.) Bücher>Fremdsprachige Bücher>Englische Bücher, Wiley-Vch Verlag GmbH

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Handbook of Wafer Bonding - Wiley-VCH
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Wiley-VCH:
Handbook of Wafer Bonding - neues Buch

ISBN: 9783527326464

ID: ef55a9299c2b70cc17b1e299750aeb3a

Filling a gap for a handbook and reference on recent developments in wafer bonding technology, an author and editor team from microsystems companies and industry-near research organizations presents reliable, first-hand information. The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories - Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries. Bücher / Fremdsprachige Bücher / Englische Bücher 978-3-527-32646-4, Wiley-VCH

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Wiley-VCH:
Handbook of Wafer Bonding - neues Buch

ISBN: 9783527326464

ID: 697175034

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories - Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries. Filling a gap for a handbook and reference on recent developments in wafer bonding technology, an author and editor team from microsystems companies and industry-near research organizations presents reliable, first-hand information. Buch (fremdspr.) Bücher>Fremdsprachige Bücher>Englische Bücher, Wiley-VCH

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Handbook of Wafer Bonding - Peter Ramm; James Jian-Qiang Lu; Maaike M. V. Taklo
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Peter Ramm; James Jian-Qiang Lu; Maaike M. V. Taklo:
Handbook of Wafer Bonding - Erstausgabe

2012, ISBN: 9783527326464

Gebundene Ausgabe, ID: 18104789

[ED: 1], 1. Auflage, Hardcover, Buch, [PU: Wiley-VCH]

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Details zum Buch
Handbook of Wafer Bonding
Autor:

Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo

Titel:

Handbook of Wafer Bonding

ISBN-Nummer:

3527326464

Detailangaben zum Buch - Handbook of Wafer Bonding


EAN (ISBN-13): 9783527326464
ISBN (ISBN-10): 3527326464
Gebundene Ausgabe
Erscheinungsjahr: 2012
Herausgeber: Wiley VCH Verlag GmbH
395 Seiten
Gewicht: 0,937 kg
Sprache: Englisch

Buch in der Datenbank seit 14.09.2008 15:42:19
Buch zuletzt gefunden am 23.10.2016 21:17:37
ISBN/EAN: 3527326464

ISBN - alternative Schreibweisen:
3-527-32646-4, 978-3-527-32646-4

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