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Handbook of Semiconductor Interconnection Technology, Second Edition - Schwartz, Geraldine C.; Srikrishnan, Kris V.
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Schwartz, Geraldine C.; Srikrishnan, Kris V.:

Handbook of Semiconductor Interconnection Technology, Second Edition - neues Buch

ISBN: 9781574446746

ID: 263549

METHODS/PRINCIPLES OF DEPOSITION AND ETCHING OF THIN FILMS; Geraldine Cogin Schwartz Introduction Evaporation Chemical Vapor Deposition Photoenhanced CVD Plasma Processing Electrochemical Deposition Spin Coating Conclusion References CHARACTERIZATION; Geraldine Cogin Schwartz Introduction Optical Characterization of Dielectric Films Infrared (IR) Spectroscopy Resistivity of Metal Films Thickness Dielectric Constant of Dielectrics Breakdown Strength Adhesion Mechanical Properties Thermal Properties Auger Electron Spectroscopy (AES) X-Ray Photoelectron Spectroscopy (XPS): Also Called Electron Spectroscopy for Chemical Analysis (ESCA) Secondary Ion Mass Spectroscopy (SIMS) Electron Microprobe X-Ray Fluorescence Spectrometry (XRFS) Hydrogen Analysis Rutherford Backscattering Spectrometry (RBS) Specular X-Ray Reflectivity (SXR) Small-Angle Neutron Scattering (SANS) Positronium Annihilation Lifetime Spectroscopy (PALS) Ellipsometric Porosimetry (EP) Scanning Electron Microscope (SEM) Transmission Electron Microscope (TEM) Focused Ion Beam (FIB) Atomic Force Microscope (AFM) Thermal Wave-Modulated Optical Reflectance Imaging (TW) X-Ray Diffraction (XRD) Wet Chemical Methods Chromatography Other Analytical Techniques Thermometry Electrochemical Methods Plasma Diagnostics References SEMICONDUCTOR CONTACT TECHNOLOGY; David R. Campbell, Revised by Catherine Ivers Introduction Importance of Contact Technology Electrical Aspects of Silicon Contacts Material Aspects Ohmic Contacts Active Device Contacts Contact Studs for ULSI Conclusions References INTERLEVEL DIELECTRICS; Geraldine Cogin Schwartz and K.V. Srikrishnan Introduction Inorganic Dielectric Films Spin-On Glasses (SOGs) Low Dielectric Constant Films Barrier Dielectric Film: a-SiC:H Porous Dielectric Films Plasma-Assisted Etching of Organic Films Reactive Ion Etching of Low-e Interlevel Dielectric Films Conclusions References METALLIZATION; Geraldine Cogin Schwartz and K.V. Srikrishnan Introduction Aluminum Aluminum Alloys Copper Tungsten Patterning of Aluminum and Aluminum Alloys Patterning of Copper Patterning of Tungsten Structure of Metal Films Chapter Summary References CHIP INTEGRATION; Geraldine Cogin Schwartz and K.V. Srikrishnan Introduction Topography, Step Coverage, and Planarization Spin-On Films Step Coverage by Deposited Films In Situ Planarization/Gap-Fill of Dielectric Films Etch-Back Processes Step Coverage, Hole-Fill Planarization of Metals Evaporation Sputter Deposition of Metals Directional Sputtering High-Density Plasmas Beam Techniques Flowage of Metal Films CVD Metals Electrochemical Deposition of Copper Embedment (Inlaid) Processes Chemical Mechanical Planarization (CMP) CMP of Inorganic Dielectric Films CMP of Low-e Films CMP of Metals Post-CMP Cleaning Problems with CMP Impact of CMP Conclusions on Topography Remaining Issues for Chip Integration Process/Structure Choice Conflicts Processes Reliability Manufacturability Wafer Size Concluding Remarks on Compatibility of M Technology Technology eBook, CRC Press

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Handbook of Semiconductor Interconnection Technology, Second Edition - Schwartz, Geraldine C.; Srikrishnan, Kris V.
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
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Schwartz, Geraldine C.; Srikrishnan, Kris V.:

Handbook of Semiconductor Interconnection Technology, Second Edition - neues Buch

ISBN: 9781574446746

ID: 263549

METHODS/PRINCIPLES OF DEPOSITION AND ETCHING OF THIN FILMS; Geraldine Cogin Schwartz Introduction Evaporation Chemical Vapor Deposition Photoenhanced CVD Plasma Processing Electrochemical Deposition Spin Coating Conclusion References CHARACTERIZATION; Geraldine Cogin Schwartz Introduction Optical Characterization of Dielectric Films Infrared (IR) Spectroscopy Resistivity of Metal Films Thickness Dielectric Constant of Dielectrics Breakdown Strength Adhesion Mechanical Properties Thermal Properties Auger Electron Spectroscopy (AES) X-Ray Photoelectron Spectroscopy (XPS): Also Called Electron Spectroscopy for Chemical Analysis (ESCA) Secondary Ion Mass Spectroscopy (SIMS) Electron Microprobe X-Ray Fluorescence Spectrometry (XRFS) Hydrogen Analysis Rutherford Backscattering Spectrometry (RBS) Specular X-Ray Reflectivity (SXR) Small-Angle Neutron Scattering (SANS) Positronium Annihilation Lifetime Spectroscopy (PALS) Ellipsometric Porosimetry (EP) Scanning Electron Microscope (SEM) Transmission Electron Microscope (TEM) Focused Ion Beam (FIB) Atomic Force Microscope (AFM) Thermal Wave-Modulated Optical Reflectance Imaging (TW) X-Ray Diffraction (XRD) Wet Chemical Methods Chromatography Other Analytical Techniques Thermometry Electrochemical Methods Plasma Diagnostics References SEMICONDUCTOR CONTACT TECHNOLOGY; David R. Campbell, Revised by Catherine Ivers Introduction Importance of Contact Technology Electrical Aspects of Silicon Contacts Material Aspects Ohmic Contacts Active Device Contacts Contact Studs for ULSI Conclusions References INTERLEVEL DIELECTRICS; Geraldine Cogin Schwartz and K.V. Srikrishnan Introduction Inorganic Dielectric Films Spin-On Glasses (SOGs) Low Dielectric Constant Films Barrier Dielectric Film: a-SiC:H Porous Dielectric Films Plasma-Assisted Etching of Organic Films Reactive Ion Etching of Low-e Interlevel Dielectric Films Conclusions References METALLIZATION; Geraldine Cogin Schwartz and K.V. Srikrishnan Introduction Aluminum Aluminum Alloys Copper Tungsten Patterning of Aluminum and Aluminum Alloys Patterning of Copper Patterning of Tungsten Structure of Metal Films Chapter Summary References CHIP INTEGRATION; Geraldine Cogin Schwartz and K.V. Srikrishnan Introduction Topography, Step Coverage, and Planarization Spin-On Films Step Coverage by Deposited Films In Situ Planarization/Gap-Fill of Dielectric Films Etch-Back Processes Step Coverage, Hole-Fill Planarization of Metals Evaporation Sputter Deposition of Metals Directional Sputtering High-Density Plasmas Beam Techniques Flowage of Metal Films CVD Metals Electrochemical Deposition of Copper Embedment (Inlaid) Processes Chemical Mechanical Planarization (CMP) CMP of Inorganic Dielectric Films CMP of Low-e Films CMP of Metals Post-CMP Cleaning Problems with CMP Impact of CMP Conclusions on Topography Remaining Issues for Chip Integration Process/Structure Choice Conflicts Processes Reliability Manufacturability Wafer Size Concluding Remarks on Compatibility of M Technology Technology, CRC Press

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Handbook of Semiconductor Interconnection Technology - Geraldine C. Schwartz (Editor), Arthur Bross, Kris V. Srikrishnan (Editor)
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Handbook of Semiconductor Interconnection Technology - neues Buch

ISBN: 9781574446746

ID: 9781574446746

First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field. What's in this Edition: Detailed discussion of electrochemical equipment for plating copperInformation on tools used for evaporation, chemical vapor deposition, and plasma processesEmphasis on measurement of mechanical and thermal properties of insulatorsMethods for characterizing porous dielectric thin filmsGreater focus on integration issues and properties of titanium, cobalt, and nickel silicidesProcess schemes based on the increased need for borderless contact gates and source/drainExpanded discussion on choices for low-dielectric insulatorsConcentration on electroplated copper, especially morphology of plated films and their propertiesDevelopments in thin film liners and barriersExpanded material on copper reliability Textbooks New, Books~~Technology~~Electronics~~General, Handbook-of-Semiconductor-Interconnection-Technology~~Geraldine-C-Schwartz, 999999999, Handbook of Semiconductor Interconnection Technology, Geraldine C. Schwartz (Editor), Arthur Bross, Kris V. Srikrishnan (Editor), 1574446746, CRC Press, , , , , CRC Press

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Handbook of Semiconductor Interconnection Technology - Geraldine Cogin Schwartz
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Hardback, [PU: Taylor & Francis Inc], Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy., Circuits & Components

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Handbook of Semiconductor Interconnection Technology - Geraldine Cogin Schwartz; Kris V. Srikrishnan; Arthur Bross; Geraldine Cogin Schwartz
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2006, ISBN: 9781574446746

ID: 7208058

[ED: 2], 2nd Revised edition, Hardcover, Buch, [PU: Crc Press Inc]

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Handbook of Semiconductor Interconnection Technology
Autor:

Schwartz Geraldine C; Srikrishnan Kris V

Titel:

Handbook of Semiconductor Interconnection Technology

ISBN-Nummer:

1574446746

This edition reflects the continued evolution of semiconductor technology, describing the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. It emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Expert contributors explore recently reported developments in thin film liners and barriers, choices for low-dielectric insulators, address major issues in processing, and cover deposition and etching of metallic films with a focus on electroplated copper. The book also examines the reliability of thin metallic and insulating films and features expanded discussions on copper reliability. Publications and patents are extensively cited throughout the book.

Detailangaben zum Buch - Handbook of Semiconductor Interconnection Technology


EAN (ISBN-13): 9781574446746
ISBN (ISBN-10): 1574446746
Gebundene Ausgabe
Erscheinungsjahr: 2006
Herausgeber: ST LUCIE PR
520 Seiten
Gewicht: 1,093 kg
Sprache: eng/Englisch

Buch in der Datenbank seit 30.05.2007 13:18:28
Buch zuletzt gefunden am 12.10.2016 02:28:38
ISBN/EAN: 1574446746

ISBN - alternative Schreibweisen:
1-57444-674-6, 978-1-57444-674-6

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