. .
Deutsch
Deutschland
Ähnliche Bücher
Weitere, andere Bücher, die diesem Buch sehr ähnlich sein könnten:
Suchtools
Anmelden

Anmelden mit Facebook:

Registrieren
Passwort vergessen?


Such-Historie
Merkliste
Links zu eurobuch.com

Dieses Buch teilen auf…
Buchtipps
Aktuelles
Tipp von eurobuch.com
FILTER
- 0 Ergebnisse
Kleinster Preis: 86,80 €, größter Preis: 169,69 €, Mittelwert: 124,33 €
Three Dimensional System Integration: IC Stacking Process and Design - Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
(*)
Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic:

Three Dimensional System Integration: IC Stacking Process and Design - gebunden oder broschiert

ISBN: 1441909613

[SR: 5477602], Hardcover, [EAN: 9781441909619], Springer, Springer, Book, [PU: Springer], Springer, Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain., 266160, Drafting & Presentation, 173508, Architecture, 1, Arts & Photography, 1000, Subjects, 283155, Books, 3508, Computer Science, 3887, AI & Machine Learning, 760204, Bioinformatics, 132559011, Computer Simulation, 107196011, Cybernetics, 132574011, Human-Computer Interaction, 107197011, Information Theory, 3897, Robotics, 602672, Systems Analysis & Design, 5, Computers & Technology, 1000, Subjects, 283155, Books, 4075, CAD, 3939, Solidworks, 4134, Graphics & Design, 5, Computers & Technology, 1000, Subjects, 283155, Books, 107178011, Design, 13698, Circuits, 227544, Electrical & Electronics, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 1058, Methods & Materials, 1061, Architecture, 13803, Reference, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 468204, Computer Science, 491298, Algorithms, 491300, Artificial Intelligence, 491306, Database Storage & Design, 491308, Graphics & Visualization, 491302, Networking, 491310, Object-Oriented Software Design, 491312, Operating Systems, 491314, Programming Languages, 491316, Software Design & Engineering, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books, 468210, Architecture, 468206, Humanities, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books

Neues Buch Amazon.com
PBShop UK
, Neuware Versandkosten:Usually ships in 1-2 business days, zzgl. Versandkosten
Details...
(*) Derzeit vergriffen bedeutet, dass dieser Titel momentan auf keiner der angeschlossenen Plattform verfügbar ist.
Three Dimensional System Integration: IC Stacking Process and Design - Papanikolaou, Antonis / Soudris, Dimitrios / Radojcic, Riko
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
(*)

Papanikolaou, Antonis / Soudris, Dimitrios / Radojcic, Riko:

Three Dimensional System Integration: IC Stacking Process and Design - gebrauchtes Buch

ISBN: 9781441909619

ID: 6748516

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. Three Dimensional System Integration: IC Stacking Process and Design Papanikolaou, Antonis / Soudris, Dimitrios / Radojcic, Riko, Springer

gebrauchtes bzw. antiquarisches Buch Betterworldbooks.com
Versandkosten:zzgl. Versandkosten
Details...
(*) Derzeit vergriffen bedeutet, dass dieser Titel momentan auf keiner der angeschlossenen Plattform verfügbar ist.
Three Dimensional System Integration: IC Stacking Process and Design - Antonis Papanikolaou (Editor), Dimitrios Soudris (Editor), Riko Radojcic (Editor)
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
(*)
Antonis Papanikolaou (Editor), Dimitrios Soudris (Editor), Riko Radojcic (Editor):
Three Dimensional System Integration: IC Stacking Process and Design - gebunden oder broschiert

2011

ISBN: 9781441909619

ID: 550577766

Springer, 2010-12-15. 2011. Hardcover. Used:Good. Buy with confidence. Excellent Customer Service & Return policy. Ships Fast. 24*7 Customer Service., Springer, 2010-12-15

gebrauchtes bzw. antiquarisches Buch Biblio.com
Ergodebooks
Versandkosten: EUR 14.12
Details...
(*) Derzeit vergriffen bedeutet, dass dieser Titel momentan auf keiner der angeschlossenen Plattform verfügbar ist.
Three Dimensional System Integration - Papanikolaou, Antonis (EDT)/ Soudris, Dimitrios (EDT)/ Radojcic, Riko (EDT)
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
(*)
Papanikolaou, Antonis (EDT)/ Soudris, Dimitrios (EDT)/ Radojcic, Riko (EDT):
Three Dimensional System Integration - gebunden oder broschiert

2010, ISBN: 9781441909619

ID: 542835495

Springer Verlag, 2010. Hardcover. New. SKU: MM-20381725; EAN: 9781441909619, Springer Verlag, 2010

gebrauchtes bzw. antiquarisches Buch Biblio.com
Media Mall
Versandkosten: EUR 16.85
Details...
(*) Derzeit vergriffen bedeutet, dass dieser Titel momentan auf keiner der angeschlossenen Plattform verfügbar ist.
Three Dimensional System Integration - Antonis Papanikolaou; Dimitrios Soudris; Riko Radojcic
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
(*)
Antonis Papanikolaou; Dimitrios Soudris; Riko Radojcic:
Three Dimensional System Integration - gebunden oder broschiert

2010, ISBN: 9781441909619

ID: 10744008

Hardcover, Buch, [PU: Springer-Verlag New York Inc.]

Neues Buch Lehmanns.de
Versandkosten:Versand in 7-9 Tagen, , Versandkostenfrei innerhalb der BRD (EUR 0.00)
Details...
(*) Derzeit vergriffen bedeutet, dass dieser Titel momentan auf keiner der angeschlossenen Plattform verfügbar ist.

< zum Suchergebnis...
Details zum Buch
Three Dimensional System Integration: IC Stacking Process and Design
Autor:

Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic

Titel:

Three Dimensional System Integration: IC Stacking Process and Design

ISBN-Nummer:

1441909613

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

Detailangaben zum Buch - Three Dimensional System Integration: IC Stacking Process and Design


EAN (ISBN-13): 9781441909619
ISBN (ISBN-10): 1441909613
Gebundene Ausgabe
Taschenbuch
Erscheinungsjahr: 2010
Herausgeber: Springer-Verlag GmbH
246 Seiten
Gewicht: 0,527 kg
Sprache: eng/Englisch

Buch in der Datenbank seit 22.04.2008 15:15:08
Buch zuletzt gefunden am 23.11.2016 20:52:42
ISBN/EAN: 1441909613

ISBN - alternative Schreibweisen:
1-4419-0961-3, 978-1-4419-0961-9

< zum Suchergebnis...
< zum Archiv...
Benachbarte Bücher