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Kleinster Preis: 74.15 EUR, größter Preis: 165.81 EUR, Mittelwert: 125.55 EUR
Introduction to Microsystem Packaging Technology - Yufeng Jin, Zhiping Wang, Jing Chen
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[SR: 1966431], Hardcover, [EAN: 9781439819104], CRC Press, CRC Press, Book, [PU: CRC Press], CRC Press, The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of  packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated techno, 13718, Microelectronics, 13707, Electronics, 227544, Electrical & Electronics, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 465600, New, Used & Rental Textbooks, 468220, Business & Finance, 468226, Communication & Journalism, 468204, Computer Science, 468224, Education, 468212, Engineering, 468206, Humanities, 468222, Law, 468228, Medicine & Health Sciences, 684283011, Reference, 468216, Science & Mathematics, 468214, Social Sciences, 684300011, Test Prep & Study Guides, 2349030011, Specialty Boutique, 283155, Books

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Introduction What are Microsystems Related Fundamentals of Microsystems What is Microsystems Packaging What is Microelectronics Packaging History of Microelectronics Packaging Status and Function of Microsystems Packaging Technology Technical Challenges in Microsystems Packaging Design Technique for Microsystems Packaging and Integration Electrical Design Thermal Management Design Mechanical Design Microfluidic Design Multi-disciplinary Design Substrate Technology Organic Substrate Ceramic Substrates Introduction of Typical Ceramic Substrates LTCC Substrates Advanced Substrates Interconnection Technology Braze-Welding Technology Wire Bonding Technology Tape Automated Bonding Technology Flip-Chip Bonding Technology Chip Interconnection in System-level Packaging Advanced interconnection Device Level Package Metal Package Plastic Package Ceramic Package Typical Examples of Device-level Package Development Prospect MEMS Packaging Function of MEMS Packaging Device Level Package for MEMS Wafer Level Package for MEMS Sealing Techniques Thin Film Encapsulation Vacuum Packaging for MEMS Case StudyA 3D Wafer Level Hermetical Packaging for MEMS Module Assembly and Optoelectronic Packaging Surface Mount Technology Packaging of Flat Panel Display Modules Optoelectronic Packaging System Level Packaging Technology Overview System on Chip Technology System in Package Technology RF System Package Technology Reliability Fundamentals of Reliability Methodology Wafer and Packaging-related Failure Mode and Mechanisms Reliability Qualification and Analysis Summary Prospects for Microsystems Packaging Technology Evolvement of Packaging Materials Evolvement and Application of Packaging Technologies Evolution of Packaging Technologies and Environmental Protection Conclusion Remarks References Technology Technology eBook, CRC Press

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ISBN: 1439819106

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[EAN: 9781439819104], Neubuch, Hardcover. The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today's information industry. The packaging process--incl.Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability. 232 pages. 0.676, [PU: Productivity Press]

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Details zum Buch
Introduction to Microsystem Packaging Technology
Autor:

Jin, Yufeng; Wang, Zhiping; Chen, Jing

Titel:

Introduction to Microsystem Packaging Technology

ISBN-Nummer:

1439819106

Vastly ahead of the field, this resource illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. It also details 3D-package and system-level package development with a decidedly MEMS perspective. Integrating the work of international engineers, this book presents a diversity of technologies in relation to MSP. The ultimate reference on this sophisticated level of package design and techniques, it covers encapsulation and sealing and system-in-package, as well as device-level and optoelectronics packaging. It also includes coverage of modular assembly, inspection, and reliability design, with a number of real-world case studies.

Detailangaben zum Buch - Introduction to Microsystem Packaging Technology


EAN (ISBN-13): 9781439819104
ISBN (ISBN-10): 1439819106
Gebundene Ausgabe
Erscheinungsjahr: 2010
Herausgeber: CRC PR INC
232 Seiten
Sprache: eng/Englisch

Buch in der Datenbank seit 24.03.2010 09:18:20
Buch zuletzt gefunden am 22.10.2016 22:25:40
ISBN/EAN: 1439819106

ISBN - alternative Schreibweisen:
1-4398-1910-6, 978-1-4398-1910-4

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