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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - Verghese, Nishath K.; Allstot, David J.; Schmerbeck, Timothy J.
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Verghese, Nishath K.; Allstot, David J.; Schmerbeck, Timothy J.:

Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - gebunden oder broschiert

1994, ISBN: 0792395441, Lieferbar binnen 4-6 Wochen Versandkosten:Versandkostenfrei innerhalb der BRD

ID: 9780792395447

Internationaler Buchtitel. In englischer Sprache. Verlag: Springer-Verlag GmbH, HC runder Rücken kaschiert, 308 Seiten, L=244mm, B=167mm, H=25mm, Gew.=603gr, [GR: 16850 - HC/Elektronik/Elektrotechnik/Nachrichtentechnik], Gebunden, Klappentext: The goal of putting `systems on a chip' has been a difficult challenge that is only recently being met. Since the world is `analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a `build it and see' mentality. The goal of putting `systems on a chip' has been a difficult challenge that is only recently being met. Since the world is `analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a `build it and see' mentality.

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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - Verghese, Nishath K. Schmerbeck, Timothy J. Allstot, David J.
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Verghese, Nishath K. Schmerbeck, Timothy J. Allstot, David J.:

Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - gebunden oder broschiert

ISBN: 9780792395447

[ED: Hardcover], [PU: Springer, Berlin], The goal of putting systems on a chip' has been a difficult challenge that is only recently being met. Since the world is analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. br/ emSimulation Techniques and Solutions for Mixed-Signal Coupling in/em emIntegrated Circuits/em addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a build it and see' mentality. br/xxiii, 280 S. 77 SW-Abb., XXIII, 280 p.Versandfertig in 3-5 Tagen, [SC: 0.00]

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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - David J. Allstot Timothy J. Schmerbeck Nishath K. Verghese
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David J. Allstot Timothy J. Schmerbeck Nishath K. Verghese:
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - gebunden oder broschiert

1994

ISBN: 9780792395447

ID: 602933345

Springer , 1994. hardcover. New. pp. 280 1 Ed. 94 The goal of putting `systems on a chip' has been a difficult challenge that is only recently being met. Since the world is `analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circu, Springer, 1994

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Nishath K. Verghese, Timothy J. Schmerbeck, David J. Allstot:
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (The Springer International Series in Engineering and Computer Science) - gebunden oder broschiert

1995, ISBN: 9780792395447

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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - gebunden oder broschiert

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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits Simulation-Techniques-and-Solutions-for-Mixed-Signal-Coupling-in-Integrated-Circuits~~Nishath-K-Verghese Science/Tech>Engineering>ELEC Engr Hardcover, Springer US

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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Autor:

Verghese, Nishath K.; Allstot, David J.; Schmerbeck, Timothy J.

Titel:

Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits

ISBN-Nummer:

0792395441

The goal of putting `systems on a chip' has been a difficult challenge that is only recently being met. Since the world is `analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a `build it and see' mentality.

Detailangaben zum Buch - Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits


EAN (ISBN-13): 9780792395447
ISBN (ISBN-10): 0792395441
Gebundene Ausgabe
Erscheinungsjahr: 1994
Herausgeber: Springer-Verlag GmbH
308 Seiten
Gewicht: 0,603 kg
Sprache: eng/Englisch

Buch in der Datenbank seit 17.03.2008 15:40:48
Buch zuletzt gefunden am 18.09.2016 22:44:39
ISBN/EAN: 0792395441

ISBN - alternative Schreibweisen:
0-7923-9544-1, 978-0-7923-9544-7

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